Semiconductor device and method of manufacturing the same
A semiconductor device includes a first bottom electrode, a second bottom electrode, a switching layer and a top electrode. The first bottom electrode has two edges opposite to each other, and an upper surface. The second bottom electrode is between the edges of the first bottom electrode and exposed from the upper surface of the first bottom electrode. The switching layer is over the first bottom electrode and the second bottom electrode. The top electrode is over the switching layer.
1. A semiconductor device, comprising:
a first bottom electrode having two edges opposite to each other, and an upper surface;
a second bottom electrode between the edges of the first bottom electrode and exposed from the upper surface of the first bottom electrode wherein a conductivity of the second bottom electrode is higher than a conductivity of the first bottom electrode;
a switching layer over the first bottom electrode and the second bottom electrode; and
a top electrode over the switching layer.
2. The semiconductor device of claim 1 , wherein a work function of the second bottom electrode is higher than a work function of the first bottom electrode.
3. The semiconductor device of claim 2 , wherein a work function difference between the second bottom electrode and the first bottom electrode is substantially greater than 0.3 eV.
4. The semiconductor device of claim 1 , wherein a conductivity ratio of the second bottom electrode to the first bottom electrode is substantially greater than 2.
5. The semiconductor device of claim 1 , wherein the first bottom electrode and the second bottom electrode are in contact with the switching layer.
6. The semiconductor device of claim 1 , wherein an upper surface of the second bottom electrode and the upper surface of the first bottom electrode are substantially coplanar.
7. The semiconductor device of claim 1 , wherein a bottom surface and at least two edges of the second bottom electrode are surrounded by the first bottom electrode.
8. The semiconductor device of claim 1 , further comprising a bottom interconnect structure under and electrically connected to the first bottom electrode, and a top interconnect structure over and electrically connected to the top electrode.
9. The semiconductor device of claim 1 , further comprising a passivation layer covering the top electrode and the switching layer.
10. A semiconductor device, comprising:
a first bottom electrode;
a second bottom electrode partially embedded in the first bottom electrode, wherein a work function of the second bottom electrode is higher than a work function of the first bottom electrode, and a conductivity of the second bottom electrode is higher than a conductivity of the first bottom electrode;
a switching layer over the first bottom electrode and the second bottom electrode; and
a top electrode over the switching layer.
11. The semiconductor device of claim 10 , wherein a work function difference between the second bottom electrode and the first bottom electrode is substantially greater than 0.3 eV.
12. The semiconductor device of claim 10 , wherein a conductivity ratio of the second bottom electrode to the first bottom electrode is substantially greater than 2.
13. The semiconductor device of claim 10 , wherein an upper surface of the second bottom electrode and an upper surface of the first bottom electrode are substantially coplanar.
14. The semiconductor device of claim 10 , wherein a material of the first bottom electrode and a material of the second bottom electrode comprise conductive materials with different ingredients.
15. The semiconductor device of claim 10 , wherein a material of the first bottom electrode and a material of the second bottom electrode comprise conductive materials with a same ingredient and with different ingredient ratios.
16. The semiconductor device of claim 15 , wherein the material of the first bottom electrode and the material of the second bottom electrode comprises metal nitride with different nitrogen concentrations.
17. A semiconductor device, comprising:
a first bottom electrode;
a second bottom electrode including edges laterally surrounded by the first bottom electrode, and an upper surface exposed the first bottom electrode, wherein a work function of the second bottom electrode is higher than a work function of the first bottom electrode;
a switching layer over the first bottom electrode and the second bottom electrode; and
a top electrode over the switching layer.
18. The semiconductor device of claim 17 , wherein the second bottom electrode includes a bottom surface covered by the first bottom electrode.
19. The semiconductor device of claim 17 , wherein an upper surface of the second bottom electrode and the upper surface of the first bottom electrode are substantially coplanar.