Crystal oscillation device

1. A crystal oscillation device comprising:

a first package material having opposing upper and lower surfaces;

a crystal unit coupled to the upper surface of the first package material;

a mounting board coupled to the lower surface of the first package material and defining a cavity in a portion of the mounting board; and

a temperature-sensitive element coupled to the lower surface of the first package material and disposed at least partially in the cavity of the mounting board,

wherein the mounting board is coupled to the lower surface of the first package material by a plurality of conductive joining materials, such that a gap is provided between the lower surface of the first package material and the mounting board other than where the plurality of conductive joining materials couple the mounting board to the first package material, and

wherein the mounting board includes first and second mounting board members spaced apart from each other to define the cavity, such that the temperature-sensitive element is disposed between the first and second mounting board members.

2. The crystal oscillation device according to claim 1 , wherein a plurality of electrode lands are disposed on an upper surface of the mounting board, and the plurality of conductive joining materials respectively join the plurality of electrode lands to the first package material.

3. The crystal oscillation device according to claim 1 , wherein the cavity of the mounting board surrounds the temperature-sensitive element.

4. The crystal oscillation device according to claim 1 , wherein each of the first and second mounting board members comprises a strip shape.

5. The crystal oscillation device according to claim 1 , wherein the first and second mounting board members comprise strip-shaped main bodies and first and second extension portions that each extend outward from the main body.

6. The crystal oscillation device according to claim 1 , further comprising a second package material mounted on the first package material to form a sealed space with the crystal unit housed therein.

7. The crystal oscillation device according to claim 1 , wherein the first package material is a package board.

8. The crystal oscillation device according to claim 1 , wherein the crystal unit is coupled to the upper surface of the first package material by an electrode land.

9. The crystal oscillation device according to claim 8 , wherein the crystal unit is attached to the first packaging material in a cantilevered manner.

10. The crystal oscillation device according to claim 1 , wherein the crystal unit comprises a crystal substrate with a pair of electrodes disposed on opposite sides of the crystal substrate.

11. The crystal oscillation device according to claim 1 , wherein the temperature-sensitive element is coupled to the lower surface of the first package material by a plurality of conductive bumps spaced apart from each other.

12. A crystal oscillation device comprising:

a first package material having opposing upper and lower surfaces;

a crystal unit coupled to the upper surface of the first package material;

a mounting board coupled to the lower surface of the first package material and defining a cavity in a portion of the mounting board; and

a temperature-sensitive element coupled to the lower surface of the first package material and disposed at least partially in the cavity of the mounting board,

wherein the mounting board is coupled to the lower surface of the first package material by a plurality of conductive joining materials, such that a gap is provided between the lower surface of the first package material and the mounting board other than where the plurality of conductive joining materials couple the mounting board to the first package material, and

wherein the mounting board comprises a shape of a frame body with a cutout portion in a plan view, such that an outer side portion and an inner side portion surrounded by the frame body communicate with each other.

13. The crystal oscillation device according to claim 12 , wherein the frame body has a rectangular frame shape, and at least a portion of a side of the rectangular frame shape is cut out.

14. A crystal oscillation device comprising:

a package material having opposing upper and lower surfaces;

a crystal unit coupled to the upper surface of the package material;

a temperature-sensitive element coupled to the lower surface of the package material; and

a mounting board coupled to the lower surface of the package material by a plurality of conductive joining materials, such that the mounting board at least partially surrounds the temperature-sensitive element,

wherein a gap is provided between the lower surface of the package material and the mounting board other than where the plurality of conductive joining materials couple the mounting board to the package material, and

wherein the mounting board includes first and second mounting board members spaced apart from each other, such that the temperature-sensitive element is disposed between the first and second mounting board members.

15. The crystal oscillation device according to claim 14 , further comprising a plurality of electrode lands disposed on an upper surface of the mounting board, wherein the plurality of conductive joining materials respectively join the plurality of electrode lands to the package material.

16. The crystal oscillation device according to claim 14 , wherein the mounting board has a cavity with the temperature-sensitive element positioned within the cavity.

17. The crystal oscillation device according to claim 14 , wherein each of the first and second mounting board members comprises a strip shape.

18. The crystal oscillation device according to claim 14 , wherein the first and second mounting board members comprise strip-shaped main bodies and first and second extension portions that each extend outward from the main body.