Natural convection cooling for power electronics systems having discrete power dissipation components

1. A power electronics based system using natural, convection cooling, comprising:

an enclosure, housing a plurality of discrete electrical components being distributed in a vertical direction from a bottom portion to a top portion of the enclosure and having a heat density weighted average center at a first height along the vertical direction;

a heat exchanger adjacent to and external of the enclosure, the heat exchanger including an inlet port in fluid communication with the enclosure and an outlet port in fluid communication with the enclosure, the heat exchanger having a vertical cooling average center at a second height along the vertical direction; and

a cooling fluid disposed in the enclosure and in the heat exchanger to cool the discrete electrical components, the discrete electrical components immersed in the cooling fluid;

wherein the discrete electrical components are positioned in the vertical direction in the enclosure such that the first height of the heat density weighted average center along the vertical direction is below the second height of the vertical cooling average center of the heat exchanger in order to sustain flow of the cooling fluid between the enclosure and the heat exchanger through natural convection; and

wherein the discrete electrical components include a plurality of capacitors, a plurality of inductors, and a plurality of semiconductor switches, and wherein the plurality of capacitors are positioned at a height along the vertical direction which is greater than a height along the vertical direction of the plurality of inductors and the plurality of semiconductor switches.

2. The system of claim 1 wherein the cooling fluid includes dielectric properties.

3. The system of claim 2 wherein the cooling fluid comprises one of a mineral oil or a vegetable oil.

4. The system of claim 2 wherein the cooling fluid comprises an FR3 vegetable oil.

5. The system of claim 1 wherein the inlet port of the heat exchanger is in fluid communication with a first portion of the enclosure and the outlet port of the heat exchanger is in fluid communication with a second portion of the enclosure.

6. The system of claim 5 wherein the first portion of the enclosure is located above the heat density weighted average center of the discrete electrical components at the first height along the vertical direction and the second portion of the enclosure is located below the heat density weighted average center of the discrete electrical components at the first height along the vertical direction.

7. The system of claim 6 wherein a flow of the cooling fluid is established along a path from the enclosure to the heat exchanger through the inlet port of the heat exchanger and from the heat exchanger to the enclosure through the outlet port.

8. The system of claim 7 wherein an integration of a cooling fluid density multiplied by gravity along the path of the cooling fluid is positive.

9. A method of cooling a power electronics based system using natural, convection cooling, comprising:

disposing in an enclosure, housing a plurality of discrete electrical components being distributed in a vertical direction from a bottom portion to a top portion of the enclosure and having a heat density weighted average center at a first height along the vertical direction;

disposing a heat exchanger adjacent to and external of the enclosure, the heat exchanger including an inlet port in fluid communication with the enclosure and an outlet port in fluid communication with the enclosure, the heat exchanger having a vertical cooling center at a second height along the vertical direction; and

providing a cooling fluid disposed in the enclosure and in the heat exchanger to cool the discrete electrical components, the discrete electrical components immersed in the cooling fluid;

wherein the discrete electrical components are positioned in the vertical direction in the enclosure such that the first height of the heat density weighted average center along the vertical direction is below the second height of the vertical cooling average center of the heat exchanger in order to sustain flow of the cooling fluid between the enclosure and the heat exchanger through natural convection; and

wherein the discrete electrical components include a plurality of capacitors, a plurality of inductors, and a plurality of semiconductor switches, and wherein the method includes positioning the plurality of capacitors at a height along the vertical direction which is greater than a height along the vertical direction of the plurality of inductors and the plurality of semiconductor switches.

10. The method of claim 9 wherein the cooling fluid includes dielectric properties.

11. The method of claim 10 wherein the cooling fluid comprises one of a mineral oil or a vegetable oil.

12. The method of claim 10 wherein the cooling fluid comprises an FR3 vegetable oil.

13. The method of claim 11 wherein the inlet port of the heat exchanger is in fluid communication with a first portion of the enclosure and the outlet port of the heat exchanger is in fluid communication with a second portion of the enclosure.

14. The method of claim 13 wherein the first portion of the enclosure is located above the heat density weighted average center of the discrete electrical components at the first height along the vertical direction and the second portion of the enclosure is located below the heat density weighted average center of the discrete electrical components at the first height along the vertical direction.

15. The method of claim 14 wherein a flow of the cooling fluid is established along a path from the enclosure to the heat exchanger through the inlet port of the heat exchanger and from the heat exchanger to the enclosure through the outlet port.

16. The method of claim 15 wherein an integration of a cooling fluid density multiplied by gravity along the path of the cooling fluid is positive.