IP Library › Granted Patent US 1,013,047
Granted Patent S1
US 1,013,047 · App. 29/829,334 · Granted Jan 30, 2024

Tetrahedron die

Inventor: Christopher Romanowski (Buffalo, NY)
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Quick Facts
Patent No.
US 1,013,047
App. No.
29/829,334
Granted
Jan 30, 2024
Kind
S1
Claims (1)

The ornamental design for an tetrahedron die, as shown and described.