Light-emitting device, module, and electronic device
A device in which warpage or distortion is less likely to occur even in a high-temperature or high-humidity environment is provided. A light-emitting device includes a first flexible substrate, a second flexible substrate, and an element layer. The first flexible substrate includes an organic resin. The second flexible substrate includes an organic resin. The element layer is positioned between the first flexible substrate and the second flexible substrate. The element layer includes a light-emitting element. The light-emitting element emits light to the first flexible substrate side. The first flexible substrate has higher average transmittance of light having a wavelength of greater than or equal to 400 nm and less than or equal to 800 nm than the second flexible substrate.
1. A light-emitting device comprising:
a first flexible substrate comprising a first organic resin material;
a first bonding layer over the first flexible substrate;
an element layer comprising a light-emitting element over the first bonding layer;
a second bonding layer over the element layer; and
a second flexible substrate comprising a second organic resin material over the second bonding layer,
wherein an opening is provided in the element layer, the second bonding layer, and the second flexible substrate,
wherein the light-emitting element is configured to emit light on the second flexible substrate side,
wherein the second flexible substrate has higher average transmittance of light having a wavelength of greater than or equal to 400 nm and less than or equal to 800 nm than the first flexible substrate,
wherein the first flexible substrate is yellower than the second flexible substrate, and
wherein the first organic resin material comprises aramid.
2. The light-emitting device according to claim 1 ,
wherein a difference in coefficient of linear expansion between the first flexible substrate and the second flexible substrate is 15 ppm/K or less.
3. The light-emitting device according to claim 1 ,
wherein a difference in thickness between the first flexible substrate and the second flexible substrate is 10 μm or less.
4. The light-emitting device according to claim 1 ,
wherein a difference between a first total thickness of the first flexible substrate and the first bonding layer and a second total thickness of the second flexible substrate and the second bonding layer is 10 μm or less.
5. The light-emitting device according to claim 1 ,
wherein a difference in thickness between the first bonding layer and the second bonding layer is 10 μm or less.
6. The light-emitting device according to claim 1 ,
wherein a first glass transition temperature of the first flexible substrate is higher than a second glass transition temperature of the second flexible substrate.
7. The light-emitting device according to claim 1 ,
wherein the each of the first bonding layer and the second bonding layer is an adhesive including an organic material.
8. The light-emitting device according to claim 1 ,
wherein the each of the first bonding layer and the second bonding layer is an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, a polyimide resin, an imide resin, a polyvinyl chloride resin, a polyvinyl butyral resin, or an ethylene vinyl acetate resin.
9. The light-emitting device according to claim 1 ,
wherein a connector connected to an FPC is connected to a conductive layer over the first flexible substrate through the opening.
10. The light-emitting device according to claim 1 ,
wherein the second organic resin material comprises polyethylene naphthalate.
11. The light-emitting device according to claim 1 ,
wherein the first flexible substrate has higher reflectance of light having a wavelength of greater than or equal to 570 nm and less than or equal to 590 nm than the second flexible substrate.
12. A module comprising the light-emitting device according to claim 1 and an FPC.
13. An electronic device comprising:
the light-emitting device according to claim 1 ; and
at least one of an antenna, a battery, a housing, a speaker, a microphone, an operation switch, and an operation button.
14. A light-emitting device comprising:
a first flexible substrate comprising a first organic resin material;
a first bonding layer over the first flexible substrate;
an element layer comprising a light-emitting element over the first bonding layer;
a second bonding layer over the element layer; and
a second flexible substrate comprising a second organic resin material over the second bonding layer,
wherein the light-emitting element is configured to emit light on the second flexible substrate side,
wherein the first flexible substrate is yellower than the second flexible substrate, and
wherein the first organic resin material comprises aramid.
15. The light-emitting device according to claim 14 ,
wherein a difference in coefficient of linear expansion between the first flexible substrate and the second flexible substrate is 15 ppm/K or less.
16. The light-emitting device according to claim 14 ,
wherein a difference in thickness between the first flexible substrate and the second flexible substrate is 10 μm or less.
17. The light-emitting device according to claim 14 ,
wherein a difference between a first total thickness of the first flexible substrate and the first bonding layer and a second total thickness of the second flexible substrate and the second bonding layer is 10 μm or less.
18. The light-emitting device according to claim 14 ,
wherein a difference in thickness between the first bonding layer and the second bonding layer is 10 μm or less.
19. The light-emitting device according to claim 14 ,
wherein a first glass transition temperature of the first flexible substrate is higher than a second glass transition temperature of the second flexible substrate.
20. The light-emitting device according to claim 14 ,
wherein the each of the first bonding layer and the second bonding layer is an adhesive including an organic material.
21. The light-emitting device according to claim 14 ,
wherein the each of the first bonding layer and the second bonding layer is an epoxy resin, an acrylic resin, a silicone resin, a phenol resin, a polyimide resin, an imide resin, a polyvinyl chloride resin, a polyvinyl butyral resin, or an ethylene vinyl acetate resin.
22. A module comprising the light-emitting device according to claim 14 and an FPC.
23. An electronic device comprising:
the light-emitting device according to claim 14 ; and
at least one of an antenna, a battery, a housing, a speaker, a microphone, an operation switch, and an operation button.
24. A light-emitting device comprising:
a first flexible substrate comprising a first organic resin material;
an element layer comprising a light-emitting element over the first flexible substrate; and
a second flexible substrate comprising a second organic resin material over the element layer,
wherein the light-emitting element is configured to emit light on the second flexible substrate side,
wherein the first flexible substrate is yellower than the second flexible substrate,
wherein the first organic resin material comprises aramid,
wherein the second organic resin material is different from the first organic resin material, and
wherein a difference in thickness between the first flexible substrate and the second flexible substrate is 10 μm or less.
25. The light-emitting device according to claim 24 ,
wherein a difference in coefficient of linear expansion between the first flexible substrate and the second flexible substrate is 15 ppm/K or less.
26. The light-emitting device according to claim 24 ,
wherein a first glass transition temperature of the first flexible substrate is higher than a second glass transition temperature of the second flexible substrate.
27. A module comprising the light-emitting device according to claim 24 and an FPC.
28. An electronic device comprising:
the light-emitting device according to claim 24 ; and
at least one of an antenna, a battery, a housing, a speaker, a microphone, an operation switch, and an operation button.