Silane additives for improved sand strength and conductivity in fracturing applications
Compositions using hardened resins as coatings for proppant particles. The methods for treating a subterranean formation with the coated proppant particles include the step of treating a subterranean formation with a composition that includes proppant particles that are coated with the hardened resin. The hardened resin is a cured product of a curable epoxy resin, a hardening agent, and an organosilicon compound.
1. A method of treating a subterranean formation, comprising:
placing a composition comprising proppant particles into the subterranean formation, wherein the proppant particles are coated with a hardened resin that is a cured product of a curable composition comprising:
a curable epoxy resin,
a hardening agent, and
an organosilicon compound of Formula I:
wherein:
each R 1 and R 2 is independently selected from optionally substituted alkyl or optionally substituted aryl,
each instance of optionally substituted alkyl is optionally interrupted by one or more of O, S, and —NH—, and
at least one of R 1 and R 2 is substituted by at least one moiety having a formula —Si(OR) n X 3-n , wherein:
each R is independently selected from OH, alkyl, cycloalkyl, and aryl, wherein at least one R is OH,
X is halo, and
n is 1, 2, or 3; and
fracturing the subterranean formation to form at least one fracture in the subterranean formation.
2. The method of claim 1 , wherein each of R 1 and R 2 is an optionally substituted alkyl, at least one of which alkyl is terminally-substituted by said moiety of the formula —Si(OR) n X 3-n .
3. The method of claim 2 , wherein each of R 1 and R 2 is terminally-substituted by said moiety of the formula —Si(OR) n X 3-n .
4. The method of claim 3 , wherein n is 3.
5. The method of claim 4 , wherein each R is OH.
6. The method of claim 5 , wherein the organosilicon compound is of Formula A:
7. The method of claim 1 , wherein the curable epoxy resin is selected from the group consisting of: a product of reaction between epichlorohydrin, bisphenol A, and a plant oil; a polyepoxide resin; and a combination thereof.
8. The method of claim 1 , wherein the hardening agent is selected from the group consisting of:
diethyl toluene diamine;
a cycloalkylamine;
3-(aminomethyl)-3,5,5-trimethylcyclohexanamine;
4,4′-diaminodiphenylsulfone;
polyethylene amine;
a composition comprising a polyamine, ethylene diamine, and bisphenol A; and
any combination thereof.
9. The method of claim 1 , wherein the curable resin and the hardening agent is present in a weight ratio of curable resin to hardening agent ranging from about 8:2 to about 1:1.
10. The method of claim 1 , wherein the curable resin and the hardening agent is present in a weight ratio of curable resin to hardening agent ranging from about 7:2 to about 5:2.
11. The method of claim 1 , wherein the curable epoxy resin comprises a polyepoxide resin and the hardening agent comprises a cycloalkylamine.
12. The method of claim 1 , wherein the curable epoxy resin comprises a product of reaction between epichlorohydrin and bisphenol A, and the hardening agent comprises 3-(aminomethyl)-3,5,5-trimethylcyclohexanamine.
13. The method of claim 1 , wherein the curable epoxy resin comprises a product of reaction between epichlorohydrin, bisphenol A, and a plant oil, and the hardening agent comprises diethyl toluene diamine.
14. The method of claim 13 , wherein the plant oil comprises a vegetable oil, an epoxidized vegetable oil, an epoxy derivative of a monoglyceride of vegetable oil, a fruit oil, a wood oil, or any combination thereof.
15. The method of claim 1 , wherein the hardened resin is present in the composition in a concentration of about 0.5% to about 5% by volume, based on the total weight of the composition.
16. The method of claim 1 , wherein the organosilicon compound is present in the composition in a concentration of about 0.1% to about 5% by volume, based on the total weight of the composition.
17. The method of claim 1 , further comprising:
placing a tubular in the subterranean formation; and
pumping the composition through the tubular and into the subterranean formation using a pump.
18. A system for performing the method of claim 1 , the system comprising:
a tubular disposed in the subterranean formation; and
a pump in fluid communication with the composition placed in the subterranean formation.
19. A method of treating a subterranean formation, comprising:
placing a composition comprising proppant particles into the subterranean formation, wherein the proppant particles are coated with a hardened resin that is a cured product of a curable composition comprising:
a curable epoxy resin comprising a product of reaction between epichlorohydrin and bisphenol A,
a hardening agent, and
an organosilicon compound of Formula A:
and fracturing the subterranean formation to form at least one fracture in the subterranean formation.
20. A composition for treating a subterranean formation, comprising:
proppant particles coated with a hardened resin that is a cured product of a curable composition comprising:
a curable epoxy resin,
a hardening agent, and
an organosilicon compound of Formula I:
wherein:
each R 1 and R 2 is independently selected from optionally substituted alkyl or optionally substituted aryl,
each instance of optionally substituted alkyl is optionally interrupted by one or more of O, S, and —NH—, and
at least one of R 1 and R 2 is substituted by at least one moiety having a formula —Si(OR) n X 3-n , wherein:
each R is independently selected from OH, alkyl, cycloalkyl, and aryl, wherein at least one R is OH,
X is halo, and
n is 1, 2, or 3.