IP Library › Granted Patent US 1,016,822
Granted Patent S1
US 1,016,822 · App. 29/817,498 · Granted Mar 5, 2024

Heat-dissipating bracket

Inventors: Wei-Chang Chen (New Taipei, TW); Jung-Wei Tsao (New Taipei, TW)
Assignee: Acer Incorporated
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Quick Facts
Patent No.
US 1,016,822
App. No.
29/817,498
Granted
Mar 5, 2024
Kind
S1
Claims (1)

The ornamental design for a heat-dissipating bracket, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2021
From: CHEN, WEI-CHANG; TSAO, JUNG-WEI
To: ACER INCORPORATED
Reel/Frame 058262/0623 →
Priority Claims (1)
TW 110304446 · Aug 23, 2021 · national