Method of transferring light-emitting diodes

1. A method of transferring light-emitting diodes, the method comprising:

picking up the light-emitting diodes from a base substrate by using a first stamper;

rotating the light-emitting diodes by about 90 degrees and mounting the light-emitting diodes on the first stamper or a sacrificial substrate;

picking up the rotated light-emitting diodes mounted on the first stamper or the sacrificial substrate by using a second stamper; and

releasing the light-emitting diodes from the second stamper towards a display substrate.

2. The method of claim 1 , wherein rotating and mounting of the light-emitting diodes comprises:

rotating the first stamper on which the light-emitting diodes are arranged; and

rotating the light-emitting diodes by about 90 degrees by pressing the light-emitting diodes on the first stamper.

3. The method of claim 2 , wherein, after the light-emitting diodes are rotated by about 90 degrees,

a layer stack direction of the light-emitting diodes arranged over the first stamper is substantially perpendicular to a layer stack direction of the light-emitting diodes arranged over the base substrate.

4. The method of claim 1 , wherein rotating and mounting of the light-emitting diodes comprises:

releasing the light-emitting diodes from the first stamper towards the sacrificial substrate; and

rotating the light-emitting diodes by about 90 degrees by stretching the sacrificial substrate.

5. The method of claim 4 ,

wherein an upper surface of the sacrificial substrate comprises a first region which is adhesive and a second region which is not adhesive, and

wherein after the sacrificial substrate is stretched, a layer stack direction of the light-emitting diodes arranged above the first region of the sacrificial substrate is substantially perpendicular to a layer stack direction of the light-emitting diodes arranged over the base substrate.

6. The method of claim 5 , wherein before the sacrificial substrate is stretched,

an upper surface of the sacrificial substrate comprises a first region substantially perpendicular to a lower surface of the sacrificial substrate and a second region, the second region forming an acute angle with the first region.

7. The method of claim 6 , wherein the first region of the sacrificial substrate comprises an adhesive.

8. The method of claim 1 ,

wherein the light-emitting diodes arranged over the base substrate comprise a structure in which a first semiconductor layer, an intermediate layer, and a second semiconductor layer are stacked on the base substrate in a first direction, the first direction substantially perpendicular to an upper surface of the base substrate, and

wherein the light-emitting diodes arranged over the display substrate comprise a structure in which the first semiconductor layer, the intermediate layer, and the second semiconductor layer are stacked on the display substrate in a second direction, the second direction substantially perpendicular to the first direction.

9. The method of claim 1 , further comprising

electrically connecting the light-emitting diodes to a first electrode and a second electrode, the first electrode and the second electrode being disposed on a layer of the display substrate.

10. The method of claim 9 , wherein the electrically connecting of the light-emitting diodes comprises

forming a first contact portion and a second contact portion, the first contact portion used to connect a first semiconductor layer of the light-emitting diodes to the first electrode of the display substrate and the second contact portion used to connect a second semiconductor layer of the light-emitting diodes to the second electrode of the display substrate.

11. A method of transferring light-emitting diodes, the method comprising:

picking up the light-emitting diodes from a base substrate by using a first stamper;

rotating the first stamper on which the light-emitting diodes are disposed ever by about 90 degrees;

rotating the light-emitting diodes by about 90 degrees by pressing the light-emitting diodes over the first stamper;

picking up the rotated light-emitting diodes disposed over the first stamper by a second stamper; and

releasing the light-emitting diodes from the second stamper towards a display substrate.

12. The method of claim 11 , wherein after the light-emitting diodes rotate by about 90 degrees,

a layer stack direction of the light-emitting diodes disposed over the first stamper is substantially perpendicular to a layer stack direction of the light-emitting diodes disposed over the base substrate.

13. The method of claim 12 ,

wherein the light-emitting diodes disposed over the base substrate comprise a structure in which a first semiconductor layer, an intermediate layer, and a second semiconductor layer are stacked on the base substrate in a first direction, the first direction substantially perpendicular to an upper surface of the base substrate, and

wherein the light-emitting diodes disposed over the display substrate comprise a structure in which the first semiconductor layer, the intermediate layer, and the second semiconductor layer are stacked on the display substrate in a second direction, the second direction substantially perpendicular to the first direction.

14. The method of claim 11 , wherein the light-emitting diodes are picked up from the base substrate by lowering the first stamper.

15. The method of claim 11 , further comprising

electrically connecting the light-emitting diodes to a first electrode and a second electrode, the first electrode and the second electrode being disposed on a layer of the display substrate.

16. A method of transferring light-emitting diodes, the method comprising:

picking up the light-emitting diodes from a base substrate by using a first stamper;

releasing the light-emitting diodes from the first stamper towards a sacrificial substrate;

rotating the light-emitting diodes disposed over the sacrificial substrate by about 90 degrees by stretching the sacrificial substrate;

picking up the rotated light-emitting diodes disposed over the sacrificial substrate by using a second stamper; and

releasing the light-emitting diodes from the second stamper towards a display substrate.

17. The method of claim 16 ,

wherein an upper surface of the sacrificial substrate comprises a first region which is adhesive and a second region which is not adhesive, and

wherein after the sacrificial substrate is stretched, a layer stack direction of the light-emitting diodes disposed over the first region is substantially perpendicular to a layer stack direction of the light-emitting diodes disposed over the base substrate.

18. The method of claim 16 ,

wherein the light-emitting diodes disposed over the base substrate comprise a structure in which a first semiconductor layer, an intermediate layer, and a second semiconductor layer are stacked on the base substrate in a first direction, the first direction substantially perpendicular to an upper surface of the base substrate, and

wherein the light-emitting diodes disposed over the display substrate comprise a structure in which the first semiconductor layer, the intermediate layer, and the second semiconductor layer are stacked in a second direction, the second direction substantially perpendicular to the first direction.

19. The method of claim 16 , wherein the light-emitting diodes are picked up from the base substrate by lowering the first stamper.

20. The method of claim 16 , further comprising

electrically connecting the light-emitting diodes to a first electrode and a second electrode, the first electrode and the second electrode being disposed on a layer of the display substrate.