Polymeric dielectrics, methods of manufacturing the same, and electronic devices and thin film transistors including the same

1. A polymeric dielectric comprising:

a coordination complex of a modified elastic polymer and a metal cation,

the modified elastic polymer including an organic ligand moiety that coordinates the metal cation in a main chain of an elastic polymer.

2. The polymeric dielectric of claim 1 , wherein the organic ligand moiety includes a heterocycle having at least one nitrogen.

3. The polymeric dielectric of claim 2 , wherein the organic ligand moiety includes one of a pyridine moiety, a bipyridine moiety, a terpyridine moiety, a pyrimidine moiety, a bipyrimidine moiety, a terpyrimidine moiety, a phenanthroline moiety, or a combination thereof.

4. The polymeric dielectric of claim 2 , wherein the organic ligand moiety further includes an acyl amide bound to the heterocycle.

5. The polymeric dielectric of claim 2 , wherein the organic ligand moiety includes 2,2′-bipyridine-5,5′-dicarboxylic amide.

6. The polymeric dielectric of claim 2 , wherein the metal cation is coordinated with a nitrogen atom of the organic ligand moiety.

7. The polymeric dielectric of claim 1 , wherein the elastic polymer is a non-polar elastic polymer.

8. The polymeric dielectric of claim 1 , wherein the elastic polymer includes one of polyurethane, polysiloxane, polydimethylsiloxane, polybutadiene, a styrene-butadiene copolymer, a styrene-butadiene-styrene copolymer, a styrene-ethylene-butylene-styrene copolymer, an ethylene propylene diene rubber, an acrylic rubber, a polychloroprene rubber, a silicone rubber, or a combination thereof.

9. The polymeric dielectric of claim 1 , wherein

the elastic polymer is polysiloxane having a siloxane repeating unit or polydimethylsiloxane having a dimethylsiloxane repeating unit, and

the organic ligand moiety is linked with terminal ends of 10 to 200 siloxane repeating units or dimethylsiloxane repeating units.

10. The polymeric dielectric of claim 1 , wherein

the elastic polymer is polysiloxane having a siloxane repeating unit or polydimethylsiloxane having a dimethylsiloxane repeating unit and

the elastic polymer includes 20 to 200 repeating units including the organic ligand moiety and the siloxane repeating unit or the organic ligand and the dimethylsiloxane repeating unit.

11. The polymeric dielectric of claim 1 , wherein the organic ligand moiety is included in an amount of about 0.01 mmol to about 10 mmol relative to 1 g of the elastic polymer.

12. The polymeric dielectric of claim 1 , wherein the modified elastic polymer is represented by Chemical Formula 1:

wherein, in Chemical Formula 1,

Z is a divalent heterocyclic group having at least one nitrogen,

L 1 and L 2 are independently a substituted C1 to C10 alkyl group or unsubstituted C1 to C10 alkyl group,

R a and R b are independently hydrogen, a substituted C1 to C10 alkyl group, or an unsubstituted C1 to C10 alkyl group,

R c and R d are independently hydrogen or a methyl group,

n is 10 to 200, and

m is 20 to 200.

13. The polymeric dielectric of claim 1 , wherein the metal cation is a multivalent metal cation.

14. The polymeric dielectric of claim 1 , wherein the metal cation is one of Zn 2+ , Fe 2+ , Cu 2+ , Ni 2+ , Co 2+ , Ru 2+ , Zn 3+ Fe 3+ , Ln 3+ , or a combination thereof.

15. The polymeric dielectric of claim 1 , further comprising:

a counter anion disposed adjacent to the metal cation.

16. The polymeric dielectric of claim 15 , wherein the counter anion includes one of a chloride (Cl—), a tetrafluoroborate (BF 4 —), perchlorate (ClO 4 —), a trifluoromethanesulfonate (CF 3 SO 3 —), a hexafluorophosphate (PF 6 —), a nitrate, an acetate, a phosphate, or a combination thereof.

17. The polymeric dielectric of claim 1 , wherein the polymeric dielectric has a dielectric constant of about 3.0 to about 3.6.

18. The polymeric dielectric of claim 1 , wherein the polymeric dielectric has a tensile strength of about 100% to about 400%.

19. An electronic device comprising:

the polymeric dielectric of claim 1 .

20. A thin film transistor comprising

a gate electrode,

a semiconductor overlapping the gate electrode,

a gate dielectric layer between the gate electrode and the semiconductor, the gate dielectric layer including the polymeric dielectric of claim 1 , and

a source electrode and a drain electrode electrically connected to the semiconductor.

21. A composition comprising:

a modified elastic polymer including an organic ligand moiety in a main chain of an elastic polymer; and

a metal salt compound.

22. The composition of claim 21 , wherein the metal salt compound is included in an amount of about 0.1 mol to about 1 mol relative to 1 mol of the organic ligand moiety.

23. The composition of claim 21 , wherein the modified elastic polymer and the metal salt compound are included in a mole ratio of about 1:5 to about 5:1.

24. The composition of claim 21 , wherein the elastic polymer includes one of polyurethane, polysiloxane, polydimethylsiloxane, polybutadiene, a styrene-butadiene copolymer, a styrene-butadiene-styrene copolymer, a styrene-ethylene-butylene-styrene copolymer, an ethylene propylene diene rubber, an acrylic rubber, a polychloroprene rubber, a silicone rubber, or a combination thereof, and

the organic ligand moiety includes one of a pyridine moiety, a bipyridine moiety, a terpyridine moiety, a pyrimidine moiety, a bipyrimidine moiety, a terpyrimidine moiety, a phenanthroline moiety, or a combination thereof.

25. The composition of claim 21 , wherein the metal salt compound includes one of FeCl 2 , ZnCl 2 , Fe(BF 4 ) 2 , Zn(BF 4 ) 2 , Fe(CF 3 SO 3 ) 2 , Zn(CF 3 SO 3 ) 2 , Fe(ClO 4 ) 2 , Zn(ClO 4 ) 2 , or a combination thereof.

26. The composition of claim 21 , wherein the composition is gelated.

27. A method of manufacturing the polymeric dielectric of claim 1 , the method comprising:

preparing the modified elastic polymer;

preparing a composition including the modified elastic polymer, a metal salt compound, and a solvent;

coating the composition on a substrate; and

drying the composition.

28. The method of claim 27 , wherein

the preparing the modified elastic polymer includes reacting an elastic polymer precursor with a nitrogen-containing heterocyclic compound,

the elastic polymer precursor includes an amine group at a terminal end of the elastic polymer precursor, and

the nitrogen-containing heterocyclic compound includes an acyl chloride at a terminal end of the nitrogen-containing heterocylic compound.

29. The method of claim 28 , wherein

the elastic polymer precursor includes bis-amine terminated polydimethylsiluxane, and

the nitrogen-containing heterocyclic compound includes 2,2′-bipyridine 5,5′-dicarboxylic acid chloride.