Bonded assembly and display device including the same
A bonded assembly including: a first electronic component including a first substrate and a plurality of first electrodes disposed in a pressed area at a first height from a surface of the first substrate; a second electronic component including a second substrate and a plurality of second electrodes disposed at a second height from a surface of the second substrate, a second electrode overlapping with a corresponding first electrode to face the first electrode; a conductive bonding layer disposed between the first electrode and the second electrode overlapped with each other to bond the first electrode and the second electrode; and at least one spacer disposed between the first substrate and the second substrate to overlap the pressed area, the at least one spacer having a thickness that is greater than a value obtained by summing the first height and the second height.
1. A bonded assembly comprising:
a first electronic component comprising a first substrate and a plurality of first electrodes disposed in a pressed area at a first height from a surface of the first substrate;
a second electronic component comprising a second substrate and a plurality of second electrodes disposed at a second height from a surface of the second substrate, the second electronic component being disposed on the first electronic component such that a second electrode overlaps a corresponding first electrode and faces the first electrode;
a conductive bonding layer disposed between the first electrode and the second electrode and configured to bond the first electrode and the second electrode; and
at least one spacer disposed between the first substrate and the second substrate to overlap the pressed area, the at least one spacer having a thickness that is greater than a sum of the first height and the second height,
wherein:
the pressed area has four sides; and
at each position corresponding to each of the four sides of the pressed area, the at least one spacer comprises a plurality of spacers that are separated from each other.
2. The bonded assembly of claim 1 , wherein the spacers overlap four edges of the pressed area.
3. The bonded assembly of claim 1 , wherein the spacers overlap four sides of the pressed area.
4. The bonded assembly of claim 1 , wherein a distance between adjacent spacers is greater than a distance between adjacent first electrodes or adjacent second electrodes.
5. The bonded assembly of claim 1 , wherein the at least one spacer is attached, printed, or deposited on at least one of the first substrate and the second substrate.
6. The bonded assembly of claim 1 , wherein the spacer has a melting point of about 200° C. or more.
7. The bonded assembly of claim 1 , further comprising an anisotropic conductive layer disposed between the first substrate and the second substrate,
wherein the anisotropic conductive layer comprises solder particles.
8. The bonded assembly of claim 1 , further comprising a non-conductive layer disposed between the first substrate and the second substrate.
9. The bonded assembly of claim 1 , wherein the at least one spacer surrounds the first electrodes and second electrodes.
10. The bonded assembly of claim 1 , further comprising at least one spacer disposed to not overlap an edge of the pressed area in the pressed area.
11. The bonded assembly of claim 1 , wherein at least one of the first electronic component and the second electronic component comprises a flexible printed circuit board.
12. A display device comprising:
a display panel; and
a bonded assembly connected to the display panel,
wherein the bonded assembly comprises:
a first flexible printed circuit board comprises a first substrate and a plurality of first electrodes disposed in a pressed area at a first height from a surface of the first substrate;
a second flexible printed circuit board comprising a second substrate and a plurality of second electrodes disposed at a second height from a surface of the second substrate, the second flexible printed circuit board being disposed on the first flexible printed circuit board such that a second electrode overlaps a corresponding first electrode and faces the first electrode;
a conductive bonding layer disposed between the first electrode and the second electrode and configured to bond the first electrode and the second electrode; and
at least one spacer disposed between the first substrate and the second substrate to overlap the pressed area, the at least one spacer having a thickness that is greater than a sum of the first height and the second height,
wherein:
the pressed area has four sides; and
at each position corresponding to each of the four sides of the pressed area, the at least one spacer comprises a plurality of spacers that are separated from each other.
13. The bonded assembly of claim 12 , wherein the spacers overlap four edges of the pressed area.
14. The display device of claim 12 , wherein the spacers overlap four sides of the pressed area.
15. The display device of claim 12 , wherein a distance between adjacent spacers is greater than a distance between adjacent first electrodes or adjacent second electrodes.
16. The display device of claim 12 , wherein the spacer has a melting point of about 200° C. or more.
17. The display device of claim 12 , wherein:
the bonded assembly further comprises an anisotropic conductive layer disposed between the first substrate and the second substrate; and
the anisotropic conductive layer comprises solder particles.
18. The display device of claim 12 , wherein the bonded assembly further comprises a non-conductive layer disposed between the first substrate and the second substrate.
19. A bonded assembly comprising:
a first electronic component comprising a first substrate and a plurality of first electrodes disposed in a pressed area at a first height from a surface of the first substrate;
a second electronic component comprising a second substrate and a plurality of second electrodes disposed at a second height from a surface of the second substrate, the second electronic component being disposed on the first electronic component such that a second electrode overlaps a corresponding first electrode and faces the first electrode;
a conductive bonding layer disposed between the first electrode and the second electrode and configured to bond the first electrode and the second electrode; and
a spacer disposed between the first substrate and the second substrate to overlap the pressed area,
wherein:
the spacer has a thickness that is greater than a sum of the first height and the second height;
the spacer completely surrounds the plurality of first electrodes and the plurality of second electrodes; and
the spacer does not contact and does not overlap any one of the first and second electrodes.
20. The bonded assembly of claim 19 , wherein the spacer completely surrounds the pressed area.