IP Library › Granted Patent US 1,018,506
Granted Patent S1
US 1,018,506 · App. 29/821,558 · Granted Mar 19, 2024

Electronics case

Inventors: Pohsun Lee (Shenzhen, CN); Laurent Lindenberger (Shenzhen, CN)
Assignee: Harman International Industries, Incorporated
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Quick Facts
Patent No.
US 1,018,506
App. No.
29/821,558
Granted
Mar 19, 2024
Kind
S1
Claims (1)

The ornamental design for an electronics case, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2022
From: LEE, POHSUN; LINDENBERGER, LAURENT
To: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
Reel/Frame 058803/0464 →