IP Library › Granted Patent US 1,018,767
Granted Patent S1
US 1,018,767 · App. 29/899,277 · Granted Mar 19, 2024

Substrate

Inventors: Paul E. Furner (Racine, WI); Paul Diehl (New York, NY)
Assignee: S. C. JOHNSON & SON, INC.
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Quick Facts
Patent No.
US 1,018,767
App. No.
29/899,277
Granted
Mar 19, 2024
Kind
S1
Claims (1)

The ornamental design for a substrate, as shown and described.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2024
From: DIEHL, PAUL
To: NICE LTD.
Reel/Frame 066265/0206 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2024
From: FURNER, PAUL E.
To: S. C. JOHNSON & SON, INC.
Reel/Frame 066265/0351 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2024
From: NICE LTD.
To: S. C. JOHNSON & SON, INC.
Reel/Frame 066265/0551 →
Continuity (1)
Continuation 29826110 · Feb 9, 2022