IP Library Granted Patent US 10,201,852
Granted Patent B2
US 10,201,852 · App. 15/318,903 · Granted Feb 12, 2019

Silver particle synthesizing method, silver particles, conductive paste producing method, and conductive paste

Inventors: Katsuaki Suganuma (Suita, JP); Jinting Jiu (Suita, JP)
Assignee: OSAKA UNIVERSITY
B22F1/0022B22F1/00B22F1/0014B22F9/24C09D5/24C09D7/68C09D7/69H01B1/00H01B1/22H01B5/00H01B13/00H05K1/09H05K1/092B22F2009/245B22F2301/255B22F2304/054B22F2304/056B22F2304/058B22F2304/10B22F2998/10H05K2201/0203
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Quick Facts
Patent No.
US 10,201,852
App. No.
15/318,903
Granted
Feb 12, 2019
Kind
B2
Abstract

A silver particle synthesizing method includes reducing a dispersant from first silver particles each covered with the dispersant to obtain second silver particles. The method further includes synthesizing third silver particles each having a larger particle diameter than the second silver particles by causing a reaction between a silver compound and a reductant in a liquid phase containing the second silver particles.

Claims (38)

1. A silver particle synthesizing method comprising:

synthesizing first silver particles each covered with a dispersant by causing a reaction between a first silver compound and a first reductant in a liquid phase containing the dispersant;

reducing the dispersant from the first silver particles to obtain second silver particles having an average particle diameter of at least 100 nanometers and no greater than 500 nanometers; and

synthesizing third silver particles each in a polyhedral shape while synthesizing fourth silver particles by causing a reaction between a second silver compound and a second reductant in a liquid phase containing the second silver particles, the third silver particles having a first particle diameter distribution, the fourth silver particles having a second particle diameter distribution different from the first particle diameter distribution, wherein

the first particle diameter distribution has an average particle diameter range of at least 1 micrometer and no greater than 15 micrometers, and

the second particle diameter distribution has an average particle diameter range of at least 100 nanometers and less than 1 micrometer.

2. The silver particle synthesizing method according to claim 1 , wherein

the second reductant is a polyalcohol.

3. The silver particle synthesizing method according to claim 2 , wherein

in the synthesizing third silver particles, the third silver particles are synthesized by heating the polyalcohol in which the second silver compound is dissolved and in which the second silver particles are dispersed.

4. The silver particle synthesizing method according to claim 2 , wherein

in the synthesizing third silver particles, the third silver particles are synthesized by dripping a first polyalcohol into a second polyalcohol and heating the polyalcohol, the second silver compound being dissolved in the first polyalcohol, the second silver particles being dispersed in the second polyalcohol, the polyalcohol containing the first and second polyalcohols.

5. The silver particle synthesizing method according to claim 4 , wherein

the second polyalcohol is heated while the first polyalcohol is dripped.

6. The silver particle synthesizing method according to claim 1 , wherein

the first reductant is a polyalcohol, and

in the synthesizing first silver particles, the first silver particles are synthesized by heating the polyalcohol in which the first silver compound is dissolved and in which the dispersant is dispersed.

7. Silver particles comprising:

silver particles each in a polyhedral shape having a first particle diameter distribution; and

silver particles having a second particle diameter distribution different from the first particle diameter distribution, wherein

the first particle diameter distribution has an average particle diameter range of at least 1 micrometer and no greater than 15 micrometers,

the second particle diameter distribution has an average particle diameter range of at least 100 nanometers and less than 1 micrometer, and

the silver particles in the polyhedral shape each have a crystal surface.

8. A conductive paste producing method comprising:

synthesizing first silver particles each covered with a dispersant by causing a reaction between a first silver compound and a first reductant in a liquid phase containing the dispersant;

reducing the dispersant from the first silver particles to obtain second silver particles having an average particle diameter of at least 100 nanometers and no greater than 500 nanometers;

synthesizing third silver particles each in a polyhedral shape while synthesizing fourth silver particles by causing a reaction between a second silver compound and a second reductant in a liquid phase containing the second silver particles, the third silver particles having a first particle diameter distribution, the fourth silver particles having a second particle diameter distribution different from the first particle diameter distribution; and

producing a conductive paste by mixing the third and fourth silver particles with an alcohol, wherein

the first particle diameter distribution has an average particle diameter range of at least 1 micrometer and no greater than 15 micrometers, and

the second particle diameter distribution has an average particle diameter range of at least 100 nanometers and less than 1 micrometer.

9. A conductive paste comprising:

silver particles each in a polyhedral shape having a first particle diameter distribution;

silver particles having a second particle diameter distribution different from the first particle diameter distribution; and

an alcohol, wherein

the first particle diameter distribution has an average particle diameter range of at least 1 micrometer and no greater than 15 micrometers,

the second particle diameter distribution has an average particle diameter range of at least 100 nanometers and less than 1 micrometer, and

the silver particles in the polyhedral shape each have a crystal surface.

10. The conductive paste according to claim 9 , which has an electric resistivity of at least 1.0×10 −6 Ω·cm and no greater than 1.0×10 −5 Ω·cm after baking at a temperature of 200° C.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2017
From: SUGANUMA, KATSUAKI; JIU, JINTING
To: OSAKA UNIVERSITY
Reel/Frame 040985/0561 →
Priority Claims (1)
JP 2014-123394 · Jun 16, 2014 · national
Continuity (1)
Related Publication 20170144220A1 · May 25, 2017
Cited By (1)
US 12,577,423