IP Library › Granted Patent US 1,020,633
Granted Patent S1
US 1,020,633 · App. 29/827,838 · Granted Apr 2, 2024

Bluetooth headset case

Inventor: Hui-Cun Liu (Shenzhen, CN)
Assignee: Shenzhen Earfun Technology Co., Ltd.
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Quick Facts
Patent No.
US 1,020,633
App. No.
29/827,838
Granted
Apr 2, 2024
Kind
S1
Claims (1)

The ornamental design for a Bluetooth headset case, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2022
From: LIU, HUI-CUN
To: SHENZHEN EARFUN TECHNOLOGY CO., LTD.
Reel/Frame 059082/0183 →