Semiconductor device including channel pattern and manufacturing method thereof
A semiconductor device and a method of manufacturing a semiconductor device, the semiconductor device including a channel pattern on a substrate, the channel pattern extending in a first direction; a gate pattern on the substrate, the gate pattern extending in a second direction crossing the first direction and surrounding the channel pattern; and an interface layer between the channel pattern and the gate pattern, the interface layer being formed on at least one surface of an upper surface and a lower surface of the channel pattern.
1. A semiconductor device, comprising:
a channel pattern on a substrate, the channel pattern extending in a first direction;
a gate pattern on the substrate, the gate pattern extending in a second direction crossing the first direction and surrounding the channel pattern; and
an interface layer between the channel pattern and the gate pattern, the interface layer being formed on at least one surface of an upper surface and a lower surface of the channel pattern,
wherein the interface layer contains carbon (C) or boron (B),
wherein:
the channel pattern includes silicon,
the interface layer includes germanium, and
a concentration of germanium in the interface layer decreases toward the channel pattern.
2. The semiconductor device as claimed in claim 1 , wherein the interface layer includes a silicon germanium carbide (SiGeC) layer.
3. The semiconductor device as claimed in claim 2 , wherein a concentration of the carbon in the interface layer ranges from 0.01 at % to 5 at %.
4. The semiconductor device as claimed in claim 1 , wherein a cross section of the channel pattern has a rectangular shape or trapezoidal shape.
5. The semiconductor device as claimed in claim 1 , wherein:
the gate pattern includes:
a gate electrode, and
a gate dielectric layer between the gate electrode and the channel pattern, and
the interface layer is between the channel pattern and the gate dielectric layer.
6. The semiconductor device as claimed in claim 1 , wherein a thickness of the interface layer is smaller than a thickness of the channel pattern.
7. The semiconductor device as claimed in claim 1 , wherein the interface layer is in direct contact with the channel pattern.
8. A semiconductor device, comprising:
a channel pattern on a substrate, the channel pattern extending in a first direction;
a gate pattern on the substrate, the gate pattern extending in a second direction crossing the first direction and surrounding the channel pattern; and
an interface layer between the channel pattern and the gate pattern, the interface layer being formed on at least one surface of an upper surface and a lower surface of the channel pattern,
wherein the interface layer contains carbon (C) or boron (B),
wherein:
the channel pattern includes silicon germanium, germanium, or a combination thereof,
the interface layer includes germanium, and
a concentration of germanium in the interface layer increases toward the channel pattern.
9. The semiconductor device as claimed in claim 8 , wherein the interface layer includes a silicon germanium carbide (SiGeC) layer.
10. The semiconductor device as claimed in claim 9 , wherein a concentration of the carbon in the interface layer ranges from 0.01 at % to 5 at %.
11. The semiconductor device as claimed in claim 8 , wherein a cross section of the channel pattern has a rectangular shape or trapezoidal shape.
12. The semiconductor device as claimed in claim 8 , wherein:
the gate pattern includes:
a gate electrode, and
a gate dielectric layer between the gate electrode and the channel pattern, and
the interface layer is between the channel pattern and the gate dielectric layer.
13. The semiconductor device as claimed in claim 8 , wherein a thickness of the interface layer is smaller than a thickness of the channel pattern.
14. The semiconductor device as claimed in claim 8 , wherein the interface layer is in direct contact with the channel pattern.
15. A method of manufacturing a semiconductor device, the method comprising:
forming a sacrificial film on a substrate;
forming an interface film on the sacrificial film such that the interface film includes carbon;
forming a channel film on the interface film;
removing the sacrificial film;
removing the interface film; and
forming a gate pattern such that the gate pattern surrounds the channel film.
16. The method as claimed in claim 15 , wherein removing the interface film includes performing a hydrogen bake treatment or a hydrogen plasma treatment.