IP Library › Granted Patent US 1,021,831
Granted Patent S1
US 1,021,831 · App. 29/808,480 · Granted Apr 9, 2024

Power semiconductor module

Inventors: Yuki Nakano (Kyoto, JP); Kenji Yamamoto (Kyoto, JP); Yasunori Kutsuma (Kyoto, JP)
Assignee: ROHM CO., LTD.
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Quick Facts
Patent No.
US 1,021,831
App. No.
29/808,480
Granted
Apr 9, 2024
Kind
S1
Claims (1)

The ornamental design for a power semiconductor module, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2021
From: NAKANO, YUKI; YAMAMOTO, KENJI; KUTSUMA, YASUNORI
To: ROHM CO., LTD.
Reel/Frame 057534/0712 →
Priority Claims (2)
JP 2021-005998 D · Mar 23, 2021 · national
JP 2021-005999 D · Mar 23, 2021 · national