IP Library › Granted Patent US 1,022,976
Granted Patent S1
US 1,022,976 · App. 29/877,695 · Granted Apr 16, 2024

Phone case

Inventor: Dongni Wu (Shenzhen, CN)
Assignee: Dongni Wu
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Quick Facts
Patent No.
US 1,022,976
App. No.
29/877,695
Granted
Apr 16, 2024
Kind
S1
Claims (1)

The ornamental design for a phone case, as shown and described.