IP Library Granted Patent US 1,023,959
Granted Patent S1
US 1,023,959 · App. 29/782,976 · Granted Apr 23, 2024

Electrode for substrate processing apparatus

Inventors: JeongHo Lee (Seoul, KR); JaeHyun Kim (Hwaseong-si, KR); JinHo Shin (Hwaseong-si, KR); HyunSoo Jang (Osan-si, KR)
Assignee: ASM IP Holding B.V.
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Quick Facts
Patent No.
US 1,023,959
App. No.
29/782,976
Granted
Apr 23, 2024
Kind
S1
Claims (1)

The ornamental design for an electrode for substrate processing apparatus, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 1, 2021
From: LEE, JEONGHO; KIM, JAEHYUN; SHIN, JINHO; JANG, HYUNSOO
To: ASM IP HOLDING B.V.
Reel/Frame 056402/0084 →