IP Library Granted Patent US 10,240,239
Granted Patent B2
US 10,240,239 · App. 15/601,452 · Granted Mar 26, 2019

Manufacturing method of metal component and manufacturing method of electronic apparatus

Inventors: Tomoyoshi Yamamura (Sakata, JP); Hiroyuki Sugawara (Tsuruoka, JP); Satoru Nishimura (Sakata, JP)
Assignee: SEIKO EPSON CORPORATION
C23F1/02B32B37/10G03F7/2002G03F7/40B32B38/10C23F1/18C23F1/28G03F7/0035G03F7/0041G03F7/095
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Quick Facts
Patent No.
US 10,240,239
App. No.
15/601,452
Granted
Mar 26, 2019
Kind
B2
Abstract

This manufacturing method of a metal component enables precision processing of a corner portion, and the radius of curvature of a cog tip of a gear and the like can be made smaller than before. The manufacturing method of a metal component includes: (a) forming a mask film having, in plan view, a first side, a second side, and an extension portion that extends from a region between the first side and the second side on a metal film; and (b) forming a corner portion having, in plan view, a third side and a fourth side by etching the metal film.

Claims (15)

1. A manufacturing method of a metal component, comprising;

(a) forming a first mask film for exposing a first region of a metal film, on the metal film;

(b) thinning the metal film in the first region by etching the metal film using the first mask film as a mask;

(c) separating the first mask film from the metal film;

(d) forming a second mask film, on the metal film, that covers a portion of the first region and exposes a second region within the first region, the second mask film including, in plan view, a first side, a second side, and an extension portion that extends from a region between the first side and the second side, in the first region; and

(e) forming a corner portion including, in plan view, a third side and a fourth side by removing at least the metal film in the second region by etching the metal film using the second mask film as a mask.

2. The manufacturing method according to claim 1 , wherein the tip of the corner portion has a radius of curvature that is smaller than 0.03 mm.

3. The manufacturing method according to claim 1 ,

wherein the step (d) includes forming a gear in which a plurality of corner portions are circumferentially arranged, and that is connected to another region of the metal film via a tie bar, and

the extension portion of the mask film has a width that is smaller than a width of the tie bar.

4. The manufacturing method according to claim 1 ,

wherein the extension portion of the mask film has a first width at a first distance from end portions of the first and second sides, and a second width that is smaller than the first width at a second distance, from the end portions of the first and second sides, that is larger than the first distance.

5. The manufacturing method according to claim 1 , further comprising bonding the metal film and a carrier tape prior to the step (a).

6. A manufacturing method of an electronic apparatus, comprising:

incorporating a metal component manufactured with the manufacturing method according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2017
From: YAMAMURA, TOMOYOSHI; SUGAWARA, HIROYUKI; NISHIMURA, SATORU
To: SEIKO EPSON CORPORATION
Reel/Frame 042457/0781 →
Priority Claims (1)
JP 2016-119628 · Jun 16, 2016 · national
Continuity (1)
Related Publication 20170362715A1 · Dec 21, 2017