IP Library Granted Patent US 10,242,871
Granted Patent B2
US 10,242,871 · App. 15/519,696 · Granted Mar 26, 2019

Resist underlayer film-forming composition including a compound having an amino group protected with a tert-butoxycarbonyl group

Inventors: Tokio Nishita (Toyama, JP); Noriaki Fujitani (Toyama, JP); Rikimaru Sakamoto (Toyama, JP)
Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
H01L21/0332C08F20/34C08F20/58C08G59/22C09D133/14G03F7/004G03F7/094G03F7/2002H01L21/0271
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Quick Facts
Patent No.
US 10,242,871
App. No.
15/519,696
Granted
Mar 26, 2019
Kind
B2
Abstract

There is provided a composition that a resist pattern having a reduced LWR representing variations in line width of the resist pattern, compared to conventional resist patterns, can be formed. A resist underlayer film-forming composition for lithography comprising a polymer, 0.1 to 30 parts by mass of a compound having an amino group protected with a tert-butoxycarbonyl group and an unprotected carboxyl group, or a hydrate of the compound, relative to 100 parts by mass of the polymer, and a solvent.

Claims (16)

1. A resist underlayer film-forming composition for lithography comprising a polymer, 0.1 to 30 parts by mass of a compound having an amino group protected with a Boc group and an unprotected carboxyl group, or a hydrate of the compound, relative to 100 parts by mass of the polymer, and a solvent,

wherein the compound is a compound of Formula (1a) or (1b):

wherein A is a C 1-6 linear hydrocarbon group, alicyclic hydrocarbon group, aromatic hydrocarbon group, or aromatic heterocyclic group, and the linear hydrocarbon group optionally has at least one hetero atom; B is a hydrogen atom or a C 1-21 organic group, and the organic group optionally has at least one linking group selected from the group consisting of a carbonyl group, an —OC(═O)— group, an —O— group, a —S— group, a sulfonyl group, and a —NH— group, and/or optionally has at least one substituent selected from the group consisting of a hydroxy group, a thiol group, a halogeno group, an amino group, and a nitro group; R 0 is a hydrogen atom or a methyl group; Z 1 and Z 2 are each independently a hydrogen atom, a hydroxy group, a halogeno group, an amino group, or a nitro group; m is 0 to 2; and n is an integer from 1 to 4.

2. The resist underlayer film-forming composition for lithography according to claim 1 , wherein the polymer has a structure of Formula (4) at an end of a polymer chain thereof:

wherein R 1 , R 2 , and R 3 are each independently a hydrogen atom, a C 1-13 linear or branched alkyl group, a halogeno group, or a hydroxy group, and at least one of R 1 , R 2 , and R 3 is the alkyl group; Ar is a benzene ring, a naphthalene ring, or an anthracene ring, and each of the two carbonyl groups is attached to one of the adjacent two carbon atoms of the ring represented by Ar; and X is a C 1-6 linear or branched alkyl group optionally having a C 1-3 alkoxy group as a substituent.

3. The resist underlayer film-forming composition for lithography according to claim 1 , which further comprises 1 to 100 parts by mass of a crosslinking agent relative to 100 parts by mass of the polymer, and 0.1 to 25 parts by mass of a crosslinking catalyst relative to 100 parts by mass of the crosslinking agent.

4. A resist underlayer film-forming composition for lithography comprising a polymer, 0.1 to 30 parts by mass of a compound having an amino group protected with a Boc group and an unprotected carboxyl group, or a hydrate of the compound, relative to 100 parts by mass of the polymer, and a solvent,

wherein the polymer has a structural unit of Formula (2) and a structural unit of Formula (3):

wherein Q 1 and Q 2 are each independently a divalent organic group having a C 1-13 hydrocarbon group optionally having a substituent, a divalent organic group having an aromatic ring, or a divalent organic group having a heterocyclic ring containing 1 to 3 nitrogen atoms.

5. The resist underlayer film-forming composition for lithography according to claim 4 , wherein the structural unit of Formula (2) is represented by Formula (2′):

wherein Q 3 is a C 1-13 hydrocarbon group optionally having a substituent, or an aromatic ring optionally having a substituent, and two v's are each independently 0 or 1.

6. The resist underlayer film-forming composition for lithography according to claim 4 , wherein the structural unit of Formula (3) is represented by Formula (3′):

wherein Q 4 is a C 1-13 hydrocarbon group optionally having a substituent, or an aromatic ring optionally having a substituent, and two w's are each independently 0 or 1.

7. The resist underlayer film-forming composition for lithography according to claim 4 , wherein the polymer has a structure of Formula (4) at an end of a polymer chain thereof:

wherein R 1 , R 2 , and R 3 are each independently a hydrogen atom, a C 1-13 linear or branched alkyl group, a halogeno group, or a hydroxy group, and at least one of R 1 , R 2 , and R 3 is the alkyl group; Ar is a benzene ring, a naphthalene ring, or an anthracene ring, and each of the two carbonyl groups is attached to one of the adjacent two carbon atoms of the ring represented by Ar; and X is a C 1-6 linear or branched alkyl group optionally having a C 1-3 alkoxy group as a substituent.

8. The resist underlayer film-forming composition for lithography according to claim 4 , which further comprises 1 to 100 parts by mass of a crosslinking agent relative to 100 parts by mass of the polymer, and 0.1 to 25 parts by mass of a crosslinking catalyst relative to 100 parts by mass of the crosslinking agent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2017
From: NISHITA, TOKIO; FUJITANI, NORIAKI; SAKAMOTO, RIKIMARU
To: NISSAN CHEMICAL INDUSTRIES, LTD.
Reel/Frame 042029/0899 →
Priority Claims (1)
JP 2014-214581 · Oct 21, 2014 · national
Continuity (1)
Related Publication 20170250079A1 · Aug 31, 2017
Cited By (1)
US 12,313,971