IP Library Granted Patent US 10,259,199
Granted Patent B2
US 10,259,199 · App. 15/487,897 · Granted Apr 16, 2019

Polymer reinforced composite plywood and laminates

Inventors: Daniel Peter Beuchel (Monroe, GA); Rustom Sam Kanga (Kennesaw, GA)
Assignee: ENGINEERED COMPOSITE SOLUTIONS, LLC
B32B21/14B32B7/02B32B7/12B32B21/02B32B21/042B32B21/08B32B27/08B32B27/12B32B27/304B32B27/308B32B27/36B32B27/365B32B27/40B32B37/1207B32B38/0004B32B2250/05B32B2250/42B32B2255/102B32B2262/101B32B2262/106B32B2307/518B32B2307/558B32B2307/584B32B2307/5825B32B2307/712B32B2307/714B32B2419/00B32B2419/04B32B2419/06B32B2471/00B32B2607/00Y10T428/24066Y10T428/31786
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Quick Facts
Patent No.
US 10,259,199
App. No.
15/487,897
Granted
Apr 16, 2019
Kind
B2
Abstract

Various examples are provided for polymer reinforced composite plywood and laminates. In one example, among others, polymer reinforced composite plywood includes a multilayer polymeric film bonded to a first ply of wood veneer and a second ply of wood veneer. A second multilayer polymeric film can be bonded to the second ply of wood veneer and to a third ply of wood veneer. In another example, polymer reinforced composite plywood includes a monolayer polymeric film bonded to a first ply of wood veneer and to a second ply of wood veneer. A second monolayer polymeric film can be bonded to the second ply of wood veneer and to a third ply of wood veneer. In another example, low pressure laminate includes a polymeric film layer bonded to a base layer that forms a protective lamination layer over the base layer.

Claims (18)

1. A polymeric-based low pressure laminate, comprising

a rigid base layer comprising medium density fiberboard (MDF), chipboard or plywood; and

a polymeric film layer comprising a first side and a second side opposite the first side, the second side having a printed wood grain type motif, pattern, or color, where the polymeric film layer is bonded to the rigid base layer under low pressure in a range from 10 bars to 30 bars (145-435 PSI) thereby forming a protective lamination layer over the rigid base layer that provides a high degree of resistance to impact, water, chemicals, and abrasion and scratch resistance of the low pressure laminate.

2. The polymeric-based low pressure laminate of claim 1 , wherein the first side of the polymeric film layer is bonded to a first side of the rigid base layer, and the second side of the polymeric film layer is over coated with a protective resin coating thereby protecting the printed wood grain type motif, pattern, or color.

3. The polymeric-based low pressure laminate of claim 2 , wherein the protective resin coating comprises melamine formaldehyde resin, urea formaldehyde resin, phenol formaldehyde resin or polyester resin.

4. The polymeric-based low pressure laminate of claim 2 , wherein the protective resin coating comprises a radiation curable resin.

5. The polymeric-based low pressure laminate of claim 1 , wherein the second side of the polymeric film layer having the printed wood grain type motif, pattern, or color is bonded to a first side of the rigid base layer under the low pressure in the range from 10 bars to 30 bars (145-435 PSI).

6. The polymeric-based low pressure laminate of claim 1 , wherein the polymeric film layer comprises a multilayer polymeric polyester film.

7. The polymeric-based low pressure laminate of claim 1 , wherein the polymeric film layer is bonded to the rigid base layer by a thermosetting polymeric adhesive comprising melamine formaldehyde resin, urea formaldehyde resin, phenol formaldehyde resin, acrylic resin, polyester resin, or polyurethane resin.

8. The polymeric-based low pressure laminate of claim 1 , wherein the polymeric film layer is bonded to the rigid base layer by a radiation curable adhesive.

9. The polymeric-based low pressure laminate of claim 2 , wherein the protective resin coating comprises acrylic resin or polyurethane resin.

10. The polymeric-based low pressure laminate of claim 1 , wherein the polymeric film layer comprises a monolayer polymeric polyester film.

11. The polymeric-based low pressure laminate of claim 2 , wherein the protective resin coating comprises a heat activated resin.

12. The polymeric-based low pressure laminate of claim 1 , wherein the polymeric film layer is bonded to the rigid base layer by a heat activated adhesive.

13. The polymeric-based low pressure laminate of claim 1 , wherein the rigid base layer comprises medium density fiberboard (MDF), chipboard, or plywood.

14. The polymeric-based low pressure laminate of claim 1 , wherein the polymeric film layer is opaque.

15. The polymeric-based low pressure laminate of claim 1 , wherein the second side comprises a printable surface having the printed wood grain type motif, pattern, or color thereon.

16. The polymeric-based low pressure laminate of claim 15 , wherein the printable surface is manufactured inline.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 15, 2017
From: BEUCHEL, DANIEL PETER; KANGA, RUSTOM SAM
To: ENGINEERED COMPOSITE SOLUTIONS, LLC
Reel/Frame 042724/0374 →
Continuity (3)
Division 14498367 · Sep 26, 2014
Provisional Application 61882781 · Sep 26, 2013
Related Publication 20170217134A1 · Aug 3, 2017
Cited By (4)
US 12,441,410 US 12,479,515 US 12,583,530 US 12,709,896