Light emitting diode having side reflection layer

1. A light emitting diode, comprising:

a substrate having a side surface and an upper surface;

a semiconductor stack disposed under the substrate and comprising a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer interposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer;

an ohmic reflection layer electrically connected to the second conductivity type semiconductor layer;

a first bump pad disposed under the ohmic reflection layer and electrically connected to the first conductivity type semiconductor layer;

a second bump pad disposed under the ohmic reflection layer and electrically connected to the second conductivity type semiconductor layer;

a side reflection layer covering the side surface of the substrate; and

a capping layer covering the upper surface of the substrate and the side reflection layer.

2. The light emitting diode according to claim 1 , further comprising:

a light transmitting material layer interposed between the side surface of the substrate and the side reflection layer.

3. The light emitting diode according to claim 2 , wherein the substrate comprises four side surfaces, and the light transmitting material layer and the side reflection layer cover the four side surfaces of the substrate.

4. The light emitting diode according to claim 2 , wherein the light transmitting material layer comprises at least one material selected from the group consisting of ITO, ZnO, SiN x , SiON, and SiO 2 .

5. The light emitting diode according to claim 2 , wherein a lower end of the light transmitting material layer is flush with a lower end of the side reflection layer.

6. The light emitting diode according to claim 1 , wherein the side reflection layer comprises a reflective metal layer and a barrier layer.

7. The light emitting diode according to claim 6 , wherein an upper end of the reflective metal layer and an upper end of the barrier layer are disposed outside the upper surface of the substrate.

8. The light emitting diode according to claim 7 , wherein the upper end of the barrier layer is placed higher than the upper end of the reflective metal layer.

9. The light emitting diode according to claim 1 , wherein:

the substrate comprises a perpendicular side surface perpendicular with respect to an upper surface of the first conductivity type semiconductor layer and an inclined side surface inclined with respect to the perpendicular side surface, and

the inclined side surface is further from the upper surface of the substrate than the perpendicular side surface.

10. The light emitting diode according to claim 9 , wherein the inclined side surface is formed by scribing and the perpendicular side surface is formed by breaking.

11. The light emitting diode according to claim 1 , wherein the capping layer comprises at least one material selected from the group consisting of SiO 2 , SiN x , SiON, ITO, a primer, and spin-on-glass (SOG).

12. The light emitting diode according to claim 1 , wherein:

the light emitting diode comprises a mesa disposed on the first conductivity type semiconductor layer,

the mesa comprises the active layer and the second conductivity type semiconductor layer,

the mesa is separated from the side surface of the substrate, and

the side reflection layer is separated from the mesa in a lateral direction.

13. The light emitting diode according to claim 12 , further comprising:

a lower insulation layer covering the ohmic reflection layer, the lower insulation layer comprising a first opening exposing the first conductivity type semiconductor layer and a second opening exposing the ohmic reflection layer;

a first pad metal layer disposed on the lower insulation layer and electrically connected to the first conductivity type semiconductor layer through the first opening;

a second pad metal layer disposed on the lower insulation layer and electrically connected to the ohmic reflection layer through the second opening; and

an upper insulation layer covering the first pad metal layer and the second pad metal layer, the upper insulation layer comprising a first opening exposing the first pad metal layer and a second opening exposing the second pad metal layer,

wherein the first bump pad is disposed on and electrically connected to the first pad metal layer through the first opening of the upper insulation layer, and

wherein the second bump pad is disposed on is electrically connected to the second pad metal layer through the second opening of the upper insulation layer.

14. The light emitting diode according to claim 13 , wherein the mesa comprises a through-hole formed through the second conductivity type semiconductor layer and the active layer to expose the first conductivity type semiconductor layer, and the first pad metal layer is electrically connected to the first conductivity type semiconductor layer exposed through the through-hole.

15. The light emitting diode according to claim 14 , wherein the mesa further comprises an indented portion formed on side surfaces of the mesa in plan view to expose the first conductivity type semiconductor layer, and the first pad metal layer is electrically connected to the first conductivity type semiconductor layer exposed through the indented portion.

16. The light emitting diode according to claim 15 , wherein the mesa has corners each having a cut shape and the first pad metal layer is electrically connected to the first conductivity type semiconductor layer at the corners of the mesa in plan view.

17. The light emitting diode according to claim 1 , further comprising an ohmic oxide layer disposed around the ohmic reflection layer and forming ohmic contact with the second conductivity type semiconductor layer.

18. The light emitting diode according to claim 1 , further comprising a wavelength converter disposed on the substrate.

19. The light emitting diode according to claim 18 , wherein the wavelength converter comprises at least one wavelength converter selected from the group consisting of wavelength converting sheet and a ceramic plate phosphor.

20. The light emitting diode according to claim 18 , wherein the wavelength converter is bonded to the capping layer via a bonding agent.