Thermal management for extend OLED and micro LED avionics life
An LED display package includes an LED display assembly, processing and graphics electronics, an LED heatsink, and a thermal isolation component. The LED display assembly includes a plurality of LEDs. The processing and graphics electronics are configured to drive the LED display assembly. The LED heatsink thermally contacts the LED display assembly, and is disposed between the LED display assembly and the processing and graphics electronics. The thermal isolation component is between the LED heatsink and the processing and graphics electronics and is arranged to thermally isolate the processing and graphics electronics from the LED heatsink.
1. A light emitting diode (LED) display package, comprising:
a LED display assembly comprising a plurality of LEDs;
processing and graphics electronics configured to drive the LED display assembly;
a LED heatsink thermally contacting the LED display assembly, and disposed between the LED display assembly and the processing and graphics electronics; and
a thermal isolation component between the LED heatsink and the processing and graphics electronics arranged to thermally isolate the processing and graphics electronics from the LED heatsink, wherein the thermal isolation component comprises a thermal insulator having a first surface facing the processing and graphics electronics, and having a second surface opposing the first surface and facing the LED heat sink, wherein only a portion of an area of the second surface contacts the LED heatsink.
2. The LED display package according to claim 1 , further comprising a wall disposed between the thermal insulator and the processing and graphics electronics, wherein the first surface contacts a surface of the wall.
3. The LED display package according to claim 2 , further comprising a chassis partially enclosing the processing and graphics electronics, wherein the chassis includes the wall.
4. The LED display package according to claim 1 , wherein only a portion of an area of the first surface contacts the wall.
5. The LED display package according to claim 1 , wherein the LED display assembly comprises one of an array of organic light emitting diodes (OLEDs) or an array of micro LEDs.
6. The LED display package according to claim 1 , further comprising a front bezel thermally contacting the LED display assembly.
7. The LED display package according to claim 1 , further comprising:
an air flow generator arranged to generate a flow of air past the LED heatsink.
8. The LED display package according to claim 1 , further comprising:
a processing and graphics electronics heat sink, separate from the LED heatsink, thermally contacting the processing and graphics electronics.
9. The LED display package according to claim 8 , wherein the processing and graphics electronics comprises one or more circuit boards.
10. The LED display package according to claim 1 , wherein the processing and graphics electronics comprises one or more circuit boards.
11. A light emitting diode (LED) display package, comprising:
a LED display assembly comprising a plurality of LEDs;
processing and graphics electronics configured to drive the LED display assembly;
a LED heatsink thermally contacting the LED display assembly, and disposed between the LED display assembly and the processing and graphics electronics;
a thermal insulating material between the LED heatsink and the processing and graphics electronics arranged to thermally isolate the processing and graphics electronics from the LED heatsink; and
a processing and graphics electronics heat sink, separate from the LED heatsink, thermally contacting the processing and graphics electronics, wherein the thermal insulating material has a first surface facing the processing and graphics electronics, and has a second surface opposing the first surface and facing the LED heat sink, wherein only a portion of an area of the second surface contacts the LED heatsink.
12. The LED display package according to claim 11 , wherein the processing and graphics electronics comprises one or more circuit boards.
13. The LED display package according to claim 11 , further comprising a wall disposed between the thermal insulating material and the processing and graphics electronics, wherein the first surface contacts a surface of the wall.
14. The LED display package according to claim 13 , further comprising a chassis partially enclosing the processing and graphics electronics, wherein the chassis includes the wall.
15. The LED display package according to claim 11 , wherein the LED display assembly comprises one of an array of organic light emitting diodes (OLEDs) or an array of micro LEDs.
16. A light emitting diode (LED) display package, comprising:
a LED display assembly comprising a plurality of LEDs;
processing and graphics electronics configured to drive the LED display assembly;
a LED heatsink thermally contacting the LED display assembly, and disposed between the LED display assembly and the processing and graphics electronics; and
a thermal isolation component between the LED heatsink and the processing and graphics electronics arranged to thermally isolate the processing and graphics electronics from the LED heatsink, wherein the thermal isolation component comprises a thermal insulator having a first surface facing the processing and graphics electronics, and having a second surface opposing the first surface and facing the LED heat sink, wherein the LED heatsink comprises a plurality of heatsink pins contacting the second surface, and the LED heatsink contacts the second surface only via the heat sink pins.