IP Library Granted Patent US 10,283,849
Granted Patent B2
US 10,283,849 · App. 15/748,287 · Granted May 7, 2019

Antenna device

Inventors: Hitoshi Hirata (Osaka, JP); Ichiro Kuwayama (Osaka, JP)
Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
H01Q1/246H01Q1/02H01Q1/1228H01Q1/42H01Q21/065H01Q21/26H04B1/036H04B1/38
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Quick Facts
Patent No.
US 10,283,849
App. No.
15/748,287
Granted
May 7, 2019
Kind
B2
Abstract

An antenna device includes: an antenna unit; a radio unit processing a radio signal transmitted or received by the antenna unit; and a heat sink unit mounted on the radio unit and externally dissipating heat of the radio unit. The antenna unit is disposed on a side identical to the heat sink unit relative to the radio unit.

Claims (14)

1. An antenna device comprising:

an antenna unit;

a radio unit processing a radio signal transmitted or received by the antenna unit; and

a heat sink unit mounted on the radio unit and externally dissipating heat of the radio unit, wherein

the antenna unit is disposed on a side identical to the heat sink unit relative to the radio unit,

the heat sink unit includes a base plate and a plurality of heat dissipation fins provided on the base plate,

the antenna unit is disposed inside a disposition region for the plurality of heat dissipation fins as seen from the identical side,

the antenna unit includes an antenna element, and a wall part surrounding the antenna element as seen from the identical side, and

the wall part is integrally formed with the base plate.

2. The antenna device according to claim 1 , wherein the heat sink unit includes a wiring-use hole for inserting a power supply line supplying power to the antenna unit from the radio unit.

3. The antenna device according to claim 1 , wherein the radio unit includes a housing and a plurality of signal processing modules housed in the housing for processing the radio signal, and

at least part of the plurality of signal processing modules is disposed denser on the identical side in the housing.

4. The antenna device according to claim 3 , wherein

the at least part of the signal processing modules is disposed at a position corresponding to the plurality of heat dissipation fins inside the housing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2018
From: HIRATA, HITOSHI; KUWAYAMA, ICHIRO
To: SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 044754/0001 →
Priority Claims (1)
JP 2015-166201 · Aug 25, 2015 · national
Continuity (1)
Related Publication 20180219277A1 · Aug 2, 2018
Cited By (1)
US 12,609,436