Vibration device and manufacturing method of the same
A vibration device that includes a support member, vibration arms connected to the support member and each having an n-type Si layer which is a degenerate semiconductor, and electrodes provided so as to excite the vibration arms, and silicon oxide films containing impurities in contact with a respective lower surface of the n-type Si layers of each vibration arm.
1. A vibration device comprising:
a support member;
at least one vibration body connected to the support member and including an n-type Si layer which is a degenerate semiconductor;
an electrode positioned to excite the vibration body; and
a first silicon oxide film containing impurities in contact with a first surface of the n-type Si layer.
2. The vibration device according to claim 1 , wherein the first surface of the n-type Si layer is opposite to the position of the electrode.
3. The vibration device according to claim 1 , further comprising:
a second silicon oxide film that contains impurities in contact with a second surface of the n-type Si layer, the second surface being opposite the first surface.
4. The vibration device according to claim 3 , further comprising:
a piezoelectric film,
wherein the electrode includes a first electrode and a second electrode, and
the piezoelectric film is sandwiched between the first electrode and the second electrode such that an excitation section is formed by the piezoelectric film, the first electrode and the second electrode on the n-type Si layer.
5. The vibration device according to claim 1 , further comprising:
a piezoelectric film,
wherein the electrode includes a first electrode and a second electrode, and
the piezoelectric film is sandwiched between the first electrode and the second electrode such that an excitation section is formed by the piezoelectric film, the first electrode and the second electrode on the n-type Si layer.
6. The vibration device according to claim 1 , further comprising a piezoelectric film, wherein the piezoelectric film is disposed so as to be sandwiched between the electrode and the n-type Si layer.
7. The vibration device according to claim 1 , wherein the silicon oxide film is a thermally oxidized silicon oxide film.
8. The vibration device according to claim 1 , wherein the impurities are a dopant doped in the n-type Si layer.
9. The vibration device according to claim 8 , wherein the n-type Si layer has a doping concentration of no less than 1×10 19 /cm 3 .
10. The vibration device according to claim 1 , wherein the n-type Si layer has a doping concentration of no less than 1×10 19 /cm 3 .
11. The vibration device according to claim 8 , wherein the dopant is P.
12. The vibration device according to claim 5 , wherein the excitation section is configured so as to cause the vibration body to perform flexural vibration.
13. The vibration device according to claim 1 ,
wherein the vibration device includes an odd number greater than one of the at least one vibration body, and
the excitation section is configured so as to cause the odd number of vibration bodies to perform out-of-plane flexural vibration.
14. The vibration device according to claim 1 ,
wherein the vibration device includes an even number of the at least one vibration body, and
the excitation section is configured so as to cause the even number of vibration bodies to perform in-plane flexural vibration.
15. A method of manufacturing a vibration device, the method comprising:
preparing a vibration body that is connected to a support member, the vibration body including an n-type Si layer having opposed first and second surfaces, a first silicon oxide film containing impurities provided on the first surface of the n-type Si layer, and a second silicon oxide film containing impurities provided on the second surface of the n-type Si layer, and
forming an electrode so as to excite the vibration body.
16. The method of manufacturing the vibration device according to claim 15 , further comprising:
forming a piezoelectric film,
wherein the electrode comprises first and second electrodes and the piezoelectric film is sandwiched between the first and second electrodes.
17. The method of manufacturing the vibration device according to claim 15 , further comprising:
forming a piezoelectric film,
wherein the piezoelectric film is sandwiched between the electrode and the n-type Si layer.
18. The method of manufacturing the vibration device according to claim 15 , wherein the preparing of the vibration body includes:
preparing a support substrate that is made of Si and has a recess in a surface thereof;
preparing the n-type Si layer; and
laminating the n-type Si layer on the support substrate so as to cover the recess of the support substrate.
19. The method of manufacturing the vibration device according to claim 15 , wherein the first and second silicon oxide films containing impurities are formed by a thermal oxidation method.