IP Library Granted Patent US 10,297,921
Granted Patent B2
US 10,297,921 · App. 15/455,663 · Granted May 21, 2019

Dipole antenna with cavity

Inventors: Robert Hill (Medford, OR); Che Ting Kuo (San Jose, CA); Bin Yu (San Jose, CA)
Assignee: SPEEDLINK TECHNOLOGY INC.
H01Q19/108H01Q9/26H01Q9/265
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Quick Facts
Patent No.
US 10,297,921
App. No.
15/455,663
Granted
May 21, 2019
Kind
B2
Abstract

A dipole antenna with resonant cavities operates with a resonant frequency near the antenna operating frequency to widen the operating bandwidth of the dipole antenna. Specifically, a ground consisting of multiple layers of electrically conductive planes and electrically conductive vias connecting the electrically conductive planes to form a ground wall cavity for a dipole member. The ground wall induces multiple resonant frequencies due to its coupling effect to the dipole member. A radio frequency (RF) frontend for mobile communication devices contains the dipole antenna with cavity coupled to a transceiver to receive and transmit communication signals.

Claims (34)

1. A dipole antenna for mobile devices, comprising:

a resonator structure comprising:

a first electrically conductive plane;

a second electrically conductive plane;

an array of electrically conductive vias disposed between and coupled to the first electrically conductive plane and the second electrically conductive plane to form a resonant cavity; and

a dipole member disposed adjacent to the resonant cavity of the resonator structure to induce at least a first resonant frequency associated with the dipole member, wherein the dipole members is raised a predetermined distance above the resonator structure based on λ, wherein λ is a wavelength associated with the dipole antenna's operating frequency.

2. The dipole antenna of claim 1 , wherein the dipole member comprises one of an open dipole antenna and a folded dipole antenna.

3. The dipole antenna of claim 2 , wherein the folded dipole antenna has a planar length of approximately λ/2 and width of approximately λ/4 dimensions.

4. The dipole antenna of claim 1 , wherein the first and second electrically conductive planes each includes a cut-out to form a rectangular resonant cavity with a planar dimension of length of approximately λ/1.7 and width of approximately λ/3.5.

5. The dipole antenna of claim 4 , wherein the array of electrically conductive vias are situated along edges of the rectangular resonant cavity, wherein the dipole member is situated substantially centrally to the rectangular resonant cavity to induce the first resonant frequency associated with the dipole member.

6. The dipole antenna of claim 1 , wherein the first electrically conductive plane is positioned substantially parallel with the second electrically conductive plane.

7. The dipole antenna of claim 1 , wherein the first electrically conductive plane and the second electrically conductive plane are coupled to an electrical ground.

8. The dipole antenna of claim 1 , wherein the second electrically conductive plane comprises an elongated strip coupled to the array of electrically conductive vias disposed thereon.

9. The dipole antenna of claim 8 , wherein the elongated strip is formed in a U-shaped strip along an edge of the resonant cavity.

10. The dipole antenna of claim 1 , wherein the dipole member is not in electrical contact with the first and second electrically conductive planes.

11. The dipole antenna of claim 1 , further comprising a dielectric material filled within a space between the dipole member, the first electrically conductive plane and the second electrically conductive plane.

12. A radio frequency (RF) frontend chip for mobile devices, comprising:

a dipole antenna; and

a transceiver coupled to the dipole antenna to transmit and receive RF signals through the dipole antenna, wherein the dipole antenna comprises:

a resonator structure comprising:

a first electrically conductive plane,

a second electrically conductive plane,

an array of electrically conductive vias disposed between and coupled to the first electrically conductive plane and the second electrically conductive plane to form a resonant cavity, and

a dipole member disposed adjacent to the resonant cavity of the resonator structure to induce at least a first resonant frequency associated with the dipole member, wherein the dipole member is raised a predetermined distance above the resonator structure based on λ, wherein λ is a wavelength associated with the dipole antenna's operating frequency.

13. The radio frequency (RF) frontend chip of claim 12 , wherein the dipole member comprises one of an open dipole antenna and a folded dipole antenna.

14. The radio frequency (RF) frontend chip of claim 13 , wherein the folded dipole antenna has a planar length of approximately λ/2 and width of approximately λ/4 dimensions.

15. The radio frequency (RF) frontend chip of claim 12 , wherein the first and second electrically conductive planes each includes a cut-out to form a rectangular resonant cavity with a planar dimension of length of approximately λ/1.7 and width of approximately λ/3.5.

16. The radio frequency (RF) frontend chip of claim 15 , wherein the array of electrically conductive vias are situated along edges of the rectangular resonant cavity, wherein the dipole member is situated substantially centrally to the rectangular resonant cavity to induce the first resonant frequency associated with the dipole member.

17. The radio frequency (RF) frontend chip of claim 12 , wherein the first electrically conductive plane is positioned substantially parallel with the second electrically conductive plane.

18. The radio frequency (RF) frontend chip of claim 12 , wherein the first electrically conductive plane and the second electrically conductive plane are coupled to an electrical ground.

19. The radio frequency (RF) frontend chip of claim 12 , wherein the second electrically conductive plane comprises an elongated strip coupled to the array of electrically conductive vias disposed thereon.

20. The radio frequency (RF) frontend chip of claim 19 , wherein the elongated strip is formed in a U-shaped strip along an edge of the resonant cavity.

21. The radio frequency (RF) frontend chip of claim 12 , wherein the dipole member is not in electrical contact with the first and second electrically conductive planes.

22. The radio frequency (RF) frontend chip of claim 12 , further comprising a dielectric material filled within a space between the dipole member, the first electrically conductive plane and the second electrically conductive plane.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2023
From: SWIFTLINK TECHNOLOGIES CO., LTD.
To: SWIFTLINK TECHNOLOGIES INC.
Reel/Frame 062712/0282 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2021
From: SWIFTLINK TECHNOLOGIES INC.
To: SWIFTLINK TECHNOLOGIES CO., LTD.; SWIFTLINK TECHNOLOGIES INC.
Reel/Frame 057688/0813 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2020
From: SPEEDLINK TECHNOLOGY INC.
To: SWIFTLINK TECHNOLOGIES INC.
Reel/Frame 053227/0623 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2018
From: SPEED WIRELESS TECHNOLOGY INC.
To: SPEEDLINK TECHNOLOGY INC.
Reel/Frame 045235/0698 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2017
From: HILL, ROBERT; KUO, CHE TING; YU, BIN
To: SPEED WIRELESS TECHNOLOGY INC.
Reel/Frame 042131/0962 →
Continuity (1)
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