IP Library › Granted Patent US 1,029,985
Granted Patent S1
US 1,029,985 · App. 29/928,068 · Granted Jun 4, 2024

Substrate

Inventors: Paul E. Furner (Racine, WI); Paul Diehl (New York, NY)
Assignee: S. C. JOHNSON & SON, INC.
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Quick Facts
Patent No.
US 1,029,985
App. No.
29/928,068
Granted
Jun 4, 2024
Kind
S1
Claims (1)

The ornamental design for a substrate, as shown and described.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2024
From: FURNER, PAUL E.
To: S. C. JOHNSON & SON, INC.
Reel/Frame 067131/0322 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2024
From: DIEHL, PAUL
To: NICE LTD.
Reel/Frame 067131/0697 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2024
From: NICE LTD.
To: S. C. JOHNSON & SON, INC.
Reel/Frame 067131/0700 →
Continuity (2)
Continuation 29899277 · Aug 7, 2023
Continuation 29826110 · Feb 9, 2022