IP Library › Granted Patent US 1,030,686
Granted Patent S1
US 1,030,686 · App. 29/808,479 · Granted Jun 11, 2024

Power semiconductor module

Inventors: Yuki Nakano (Kyoyo, JP); Yasunori Kutsuma (Kyoyo, JP); Kenji Yamamoto (Kyoyo, JP)
Assignee: ROHM CO., LTD.
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Quick Facts
Patent No.
US 1,030,686
App. No.
29/808,479
Granted
Jun 11, 2024
Kind
S1
Claims (1)

The ornamental design for a power semiconductor module, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2021
From: NAKANO, YUKI; KUTSUMA, YASUNORI; YAMAMOTO, KENJI
To: ROHM CO., LTD.
Reel/Frame 057534/0764 →
Priority Claims (2)
JP 2021-005996 D · Mar 23, 2021 · national
JP 2021-005997 D · Mar 23, 2021 · national