IP Library › Granted Patent US 1,031,026
Granted Patent S1
US 1,031,026 · App. 29/859,142 · Granted Jun 11, 2024

Bond pattern for substrate

Inventors: Ray Dennis Dria (Mason, OH); Michael Joseph Page (Cincinnati, OH); Joseph Leslie Grolmes (Madeira, OH); Scott Alan King (Liberty Township, OH); Matthew Steven Ritter (Liberty Township, OH); Christopher Colin Arp (Mason, OH)
Assignee: The Procter & Gamble Company
A61F13/515A61F13/15699A61F13/15756A61F13/511A61F13/514A61F13/53A61F13/55115A61F2013/1591A61F2013/51078
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Quick Facts
Patent No.
US 1,031,026
App. No.
29/859,142
Granted
Jun 11, 2024
Kind
S1
Claims (1)

The ornamental design for the bond pattern for a substrate, as shown and described above.

Continuity (2)
Division 29807499 · Sep 13, 2021
Continuation 16357685 · Mar 19, 2019