Low thermal impedance structure in a phased array
An antenna system including: a metal base plate; an antenna element arranged on and extending away from the front side of the base plate; a circuit board including a ground plane, adjacent to, and in thermal contact with the base plate; a plurality of electrical components on the circuit board including a power amplifier and an I/O connector; a metal support plate separated from, parallel to, and facing the base plate, with the circuit board located between the base and support plates; a plurality of thermally conductive standoffs thermally connecting the base plate to the support plate; and a master board including an I/O connector mating with the I/O connector on the circuit board and electrically connecting the circuit board to the master board, the master board located between the circuit board and the support plate and including signal paths for routing signals to the circuit board.
1. An antenna system comprising:
a thermally conductive heat sink assembly with a front side and a back side and including a plurality of parallel metal fins on the front side for convectively dissipating heat;
a plurality of antenna modules mounted on the back side of the heat sink assembly, each antenna module of the plurality of antenna modules comprising a thermally conductive base plate with a front side and a back side, and one or more antenna elements arranged on and extending away from the front side of the base plate, and the back side of the base plate is in thermal contact with the back side of the heat sink assembly,
wherein the one or more antenna elements of the plurality of antenna modules mounted on the heat sink assembly form a grid pattern with columns oriented in a vertical direction and rows oriented in a horizontal direction, and
wherein metal fins of the plurality of parallel metal fins are aligned on the front side of the heat sink assembly at an inclined angle relative to the vertical direction.
2. The antenna system of claim 1 , further comprising a master board mounted on the back side of the heat sink assembly, said master board including signal paths for routing signals to the plurality of antenna modules and including a plurality of I/O connectors, and wherein the antenna modules of the plurality of antenna modules are electrically connected to the master board, and
wherein each antenna module of the plurality of antenna modules comprises:
a circuit board with front and back sides and including a ground plane on the back side of the circuit board, said ground plane of the circuit board next to and in thermal contact with the back side of the base plate;
a plurality of electrical components mounted on the circuit board, said plurality of electrical components including an I/O connector that mates with a corresponding I/O connector of the plurality of I/O connectors on the master board to electrically connect the circuit board to the master board; and
one or more power amplifiers in thermal contact with the base plate, said one or more power amplifiers for driving the one or more antenna elements within that antenna module.
3. The antenna system of claim 2 , wherein the master board includes only passive electrical components.
4. The antenna system of claim 2 , wherein the signal paths on the master board are for routing IF and local oscillator signals to the circuit boards in each antenna module of the plurality of antenna modules.
5. The antenna system of claim 2 , further comprising a thermally conductive support plate, wherein the master board is mounted on the support plate and the support plate is thermally connected to the heat sink assembly.
6. The antenna system of claim 5 , wherein the support plate and the base plate in each antenna module of the plurality of antenna modules is made of metal.
7. The antenna system of claim 5 , wherein the thermally conductive support plate has a front side and a back side, wherein each antenna module of the plurality of antenna modules further comprises a plurality of thermally conductive standoffs, and
wherein within each antenna module of the plurality of antenna modules the back side of the base plate is separated from, parallel to, and facing the support plate, the circuit board in that antenna module is located between the base plate and the support plate, and the plurality of thermally conductive standoffs thermally connect the base plate to the support plate.
8. The antenna system of claim 7 , wherein the master board has a plurality of holes through which the plurality of standoffs pass to thereby thermally connect the base plates of the plurality of antenna modules to the support plate.
9. The antenna system of claim 2 , wherein within each antenna module of the plurality of antenna modules the one or more power amplifiers are mounted directly on the base plate of that antenna module.
10. The antenna system of claim 2 , wherein within each antenna module of the plurality of antenna modules the one or more power amplifiers are on the circuit board.
11. The antenna system of claim 1 , wherein all of the antenna modules of the plurality of antenna modules are identical to each other.
12. The antenna system of claim 1 , wherein within each antenna module of the plurality of antenna modules the one or more antenna elements is a plurality of antenna elements.
13. The antenna system of claim 1 , wherein the base plate in each antenna module of the plurality of antenna modules is made of metal.
14. The antenna system of claim 1 , wherein the circuit board in each antenna module of the plurality of antenna modules is a printed wire board.
15. The antenna system of claim 1 , wherein the master board is a printed wire board.