IP Library Granted Patent US 10,318,461
Granted Patent B2
US 10,318,461 · App. 15/669,026 · Granted Jun 11, 2019

Systems and methods for interconnecting GPU accelerated compute nodes of an information handling system

Inventor: Bhavesh Govindbhai Patel (Austin, TX)
Assignee: Dell Products L.P.
G06F13/4027G06F13/4068G06F13/4282
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Quick Facts
Patent No.
US 10,318,461
App. No.
15/669,026
Granted
Jun 11, 2019
Kind
B2
Abstract

An information handling system includes first and second compute nodes, each compute node including a central processing unit (CPU), a computational accelerator (CAC). An inter-accelerator transport (IAT) interface of each node connects to an IAT transport to provide an external interconnect, directly coupling first node GPUs with second node GPUs, for inter-node GPU-to-GPU (GtG) data traffic. Inter-node adapters on each node connect to an inter-node transport (INT) to provide an external interconnect coupling the GPUs of one node to the CPU/root of the other node for carrying inter-node non-GtG data traffic. Interconnects carrying non-GtG traffic, including the INT, may be ×16 PCIe 3.0 or later links while interconnects carrying GtG traffic, including the IAT interconnects, may be implemented as greater-than-PCIe (GTP) interconnects where GTP interconnects have a data transfer rate exceeding comparable PCIe data transfer rates, e.g., 16 GB/s per ×16 PCIE 3.0.

Claims (69)

1. An information handling system, comprising:

a first compute node, wherein the first compute node includes:

a central processing unit (CPU);

a first computational accelerator (CAC) comprising a plurality of graphics processing units (GPUs);

a node switch;

a first inter-accelerator transport (TAT) interface configured to receive an IAT comprising one or more IAT interconnects, wherein each IAT interconnect is configured to carry inter-node GPU-to-GPU (GtG) traffic, comprising data traffic between a GPU in the first CAC and a GPU in a second CAC, wherein the second CAC comprises a CAC of a second compute node; and

compute node interconnects, wherein the compute node interconnects include:

node switch interconnects, wherein the node switch interconnects include:

an interconnect coupling the CPU and the node switch; and

one or more switch-to-GPU (StG) interconnects coupling the node switch and one or more of the plurality of GPUs; and

a plurality of CAC interconnects, including:

one or more (GtI) interconnects, wherein each of the one or more GtI interconnects connects a GPU in the first CAC to the IAT interface; and

a plurality of GtG interconnects wherein each GtG interconnect connects two of the GPUs in the first CAC;

wherein each of the node switch interconnects is implemented in accordance with a peripheral components interconnect express (PCIe) interconnect technology; and

wherein each of the one or more IAT interconnects, each of the one or more GtI interconnects, and each of the plurality of GtG interconnects are implemented in accordance with a second interconnect technology wherein the second interconnect technology comprises a greater-than-PCIe (GTP) interconnect technology having an achievable data rate exceeding an achievable data rate of a PCIe interconnect technology.

2. The information handling system of claim 1 , further comprising:

a first inter-node adapter configured to couple the first compute node to an inter-node transport (INT), wherein:

the INT is configured to connect the first inter-node adapter to a second inter-node adapter;

the second inter-node adapter comprises an inter-node adapter of the second compute node; and

the IAT is configured to carry inter-node non-GtG traffic.

3. The information handling system of claim 2 , wherein the node switch interconnects include an interconnect coupling the node switch and the first inter-node adapter.

4. The information handling system of claim 2 , wherein the second interconnect technology includes an upstream sublink, comprising a first plurality of eight or more differential signals, and a downstream sublink, comprising a second plurality of eight or more differential signals.

5. The information handling system of claim 4 , each of the first plurality of eight or more differential signals corresponds to a twisted copper pair.

6. The information handling system of claim 4 , one or more StG interconnects include an StG interconnect corresponding to each of the plurality of GPUs.

7. The information handling system of claim 4 , wherein:

each of the node switch interconnects includes a PCIe link comprising at least 16 bidirectional lanes.

8. The information handling system of claim 4 , wherein the first and second compute nodes are housed in separate chassis and wherein the IAT interface and the INT comprise external interconnects.

9. The information handling system of claim 4 , wherein each of the eight or more differential signals supports 20 giga-transactions per second.

10. The information handling system of claim 4 , wherein each of the GPUs includes:

a switch port configured to receive one of the StG interconnects; and

a plurality of G-ports, each configured to receive a GtG interconnect.

11. The information handling system of claim 4 , wherein:

at least two GtG interconnects connect a pair of the GPUs wherein the pair of the GPUs includes a first GPU and a second GPU; and

at least two GtI interconnects are connected to at least one of the GPUs.

12. The information handling system of claim 4 , wherein:

the first IAT interface includes a plurality of connector blocks; and

the IAT includes a plurality of IAT interconnects, including an IAT interconnect corresponding to each of the plurality of connector blocks.

13. The information handling system of claim 12 , wherein the first inter-node adapter includes an inter-node switch configured to receive an adapter local interconnect connected to the node switch.

14. The information handling system of claim 12 , wherein the plurality of connector blocks includes a plurality of quad small form-factor plugabble double density (QSFP-DD) connectors, each configured to connect one of the GtI interconnects to one of the IAT interconnects.

15. A compute node assembly for use in an information handling system, wherein the compute node assembly comprises:

a central processing unit (CPU);

a first computational accelerator (CAC) comprising a plurality of graphics processing units (GPUs);

a node switch;

a first inter-accelerator transport (TAT) interface configured to receive an IAT comprising one or more IAT interconnects, wherein each IAT interconnect is configured to carry traffic between a GPU in the first CAC and a GPU in a second CAC, wherein the second CAC comprises a CAC of a second compute node; and

compute node interconnects, wherein the compute node interconnects include:

node switch interconnects, wherein the node switch interconnects include:

an interconnect coupling the CPU and the node switch; and

one or more switch-to-GPU (StG) interconnects coupling the node switch and one or more of the plurality of GPUs; and

a plurality of CAC interconnects, including:

one or more (GtI) interconnects, wherein each of the one or more GtI interconnects connects a GPU in the first CAC to the IAT interface; and

a plurality of GPU-to-GPU (GtG) interconnects wherein each GtG interconnect connects two of the GPUs in the first CAC;

wherein each of the node switch interconnects is implemented in accordance with a first interconnect technology; and

wherein each of the one or more IAT interconnects, each of the one or more GtI interconnects, and each of the plurality of GtG interconnects are implemented in accordance with a second interconnect technology wherein the second interconnect technology has an achievable data rate exceeding an achievable data rate of the first interconnect technology.

16. The compute node assembly of claim 15 , wherein the first interconnect technology comprises a peripheral component interconnect express (PCIe) standard and the CAC interconnects comply with a second interconnect standard that differs from the PCIe standard, wherein a maximum data rate of the second interconnect standard exceeds a maximum date rate of the PCIe standard.

17. The compute node assembly of claim 15 , wherein each of the GPUs includes:

a switch port configured to receive a node switch interconnect; and

a plurality of G-ports, each configured to receive a CAC interconnect, wherein the plurality of G-ports include:

one or more G-ports connected to an GtI interconnect; and

one or more G-ports connected to a GtG interconnect.

18. The compute node assembly of claim 17 , wherein the CAC interconnects include:

at least one GtG interconnect for each unique pair of the GPUs; and

at least one GtI interconnect for each of the GPUs.

19. The compute node assembly of claim 18 , wherein:

the first CAC includes four GPUs;

each of the four GPUs includes six G-ports; and

the CAC interconnects include:

six GtI interconnects; and

nine GtG interconnects.

20. The compute node assembly of claim 19 , wherein the first IAT interface includes six external connector blocks, the inter-accelerator transport includes six external cables wherein each external cable of the inter-accelerator transport is connected to one of the connector blocks.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (043775/0082) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060958/0468 →
RELEASE OF SECURITY INTEREST AT REEL 043772 FRAME 0750 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058298/0606 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2017
From: PATEL, BHAVESH GOVINDBHAI
To: DELL PRODUCTS L.P.
Reel/Frame 043525/0038 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Sep 6, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 043772/0750 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Sep 6, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 043775/0082 →
Continuity (1)
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