IP Library › Granted Patent US 1,033,661
Granted Patent S1
US 1,033,661 · App. 29/881,752 · Granted Jul 2, 2024

Electronic cupping device

Inventor: Jun Long Liu (Dongguan, CN)
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Quick Facts
Patent No.
US 1,033,661
App. No.
29/881,752
Granted
Jul 2, 2024
Kind
S1
Claims (1)

The ornamental design for an electronic cupping device, as shown and described.

Priority Claims (1)
CN 202230647218.1 · Sep 29, 2022 · national