IP Library › Granted Patent US 1,034,606
Granted Patent S1
US 1,034,606 · App. 29/853,015 · Granted Jul 9, 2024

Housing module for an electronic device

Inventors: Jody Akana (Los Altos Hills, CA); Molly Anderson (San Francisco, CA); Bartley K. Andre (Palo Alto, CA); Shota Aoyagi (San Francisco, CA); Anthony Michael Ashcroft (San Francisco, CA); John J. Baker (Campbell, CA); Marine C. Bataille (San Francisco, CA); Jeremy Bataillou (San Francisco, CA); Markus Diebel (San Francisco, CA); Richard Hung Minh Dinh (Saratoga, CA); Michael Walter Firka (Cupertino, CA); M. Evans Hankey (San Francisco, CA); Julian Hoenig (San Francisco, CA); Richard P. Howarth (San Francisco, CA); Jonathan P. Ive (San Francisco, CA); Julian Jaede (San Francisco, CA); Duncan Robert Kerr (San Francisco, CA); Benjamin J. Pope (Mountain View, CA); Peter Russell-Clarke (San Francisco, CA); Benjamin Andrew Shaffer (San Jose, CA); Mikael Silvanto (San Francisco, CA); Sung-Ho Tan (Vienna, AT); Clement Tissandier (San Francisco, CA); Eugene Antony Whang (San Francisco, CA); Yaocheng Zhang (Sunnyvale, CA); Rico Zörkendörfer (San Francisco, CA)
Assignee: Apple Inc.
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Quick Facts
Patent No.
US 1,034,606
App. No.
29/853,015
Granted
Jul 9, 2024
Kind
S1
Claims (1)

The ornamental design for a housing module for an electronic device, as shown and described.

Continuity (1)
Continuation 29660997 · Aug 23, 2018