IP Library › Granted Patent US 1,035,020
Granted Patent S1
US 1,035,020 · App. 29/867,830 · Granted Jul 9, 2024

Thermal pack

Inventors: Yuuki Nonomura (Ibaraki, JP); Hirokazu Watanabe (Ibaraki, JP)
Assignee: KOBAYASHI PHARMACEUTICAL CO., LTD.
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Quick Facts
Patent No.
US 1,035,020
App. No.
29/867,830
Granted
Jul 9, 2024
Kind
S1
Claims (1)

The ornamental design for a thermal pack, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2022
From: NONOMURA, YUUKI; WATANABE, HIROKAZU
To: KOBAYASHI PHARMACEUTICAL CO., LTD.
Reel/Frame 061714/0317 →
Priority Claims (1)
JP 2022-010449 D · May 17, 2022 · national