Modeling 3D physical connectivity into planar 2D domain to identify via redundancy
An integrated circuit (IC) design is received. The IC design has devices on different layers electrically connected to each other by conductive vias extending between the different layers. Relative locations of the vias, and of conductive components of the devices within adjacent layers of the different layers, are identified. The conductive components that overlap redundant vias are also identified. This allows 2D via checker data, that is a combination of the 3D adjacent layers, to be generated. The 2D via checker data includes rectangular geometric shapes that represent each instance of the conductive components overlapping redundant vias. Thus, the 2D via checker data is output, and lack of rectangular geometric shapes in the 2D via checker data provides data of locations in the IC design that fail to have redundant vias.
1. A method comprising:
receiving an integrated circuit (IC) design into a computerized device, wherein the IC design is of a three-dimensional structure and has devices on different layers electrically connected to each other by conductive vias extending between the different layers;
identifying relative locations of the conductive vias and of conductive components of the devices within adjacent layers of the different layers to transform the three-dimensional structure into two-dimensional representations;
determining which of the conductive components within the adjacent layers overlap redundant vias of the conductive vias;
generating via checker data of a combination of the adjacent layers that includes closed-loop geometric shapes representing each instance of the conductive components overlapping redundant vias, and includes open-loop geometric shapes representing each instance of the conductive components failing to have overlapping redundant vias; and
outputting the via checker data, wherein the open-loop geometric shapes provide data of locations in the IC design that fail to have the redundant vias.
2. The method according to claim 1 , wherein the identifying relative locations of the conductive vias and of conductive components comprises aligning two-dimensional representations of the adjacent layers and a corresponding two-dimensional representation of the conductive vias.
3. The method according to claim 2 , wherein the determining which of the conductive components overlap locations of redundant vias comprises identifying where the conductive components and the conductive vias overlap when the two-dimensional representations of the adjacent layers and the corresponding two-dimensional representation of the conductive vias are aligned.
4. The method according to claim 1 , wherein the closed-loop geometric shapes comprise an unbroken loop of connected shapes where there are redundant vias, and
wherein the open-loop geometric shapes comprise a broken loop of disconnected shapes where there are not redundant vias.
5. The method according to claim 1 , wherein the closed-loop geometric shapes and open-loop geometric shapes are different from any shapes used to represent the devices or the conductive vias.
6. The method according to claim 1 , further comprising removing known shapes from the via checker data.
7. The method according to claim 1 , wherein the via checker data is not a layer of the IC design and is different from the different layers of the IC design.
8. A method comprising:
receiving an integrated circuit (IC) design into an input/output of a computerized device, wherein the IC design is of a three-dimensional structure and has devices on different layers electrically connected to each other by conductive vias extending between the different layers;
identifying relative locations of the conductive vias and of conductive components of the devices within adjacent layers of the different layers to transform the three-dimensional structure into two-dimensional representations using a processor of the computerized device, wherein the conductive components run parallel and perpendicular to one another in the different layers;
determining which of the conductive components within the adjacent layers overlap redundant vias of the conductive vias using the processor;
generating via checker data of a combination of the adjacent layers that includes closed-loop rectangular geometric shapes representing each instance of the conductive components overlapping redundant vias, and includes open-loop rectangular geometric shapes representing each instance of the conductive components failing to have overlapping redundant vias, using the processor; and
outputting the via checker data from the input/output,
wherein the open-loop rectangular geometric shapes in the via checker data provides data of locations in the IC design that fail to have redundant vias.
9. The method according to claim 8 , wherein the identifying relative locations of the conductive vias and of conductive components comprises aligning two-dimensional representations of the adjacent layers and a corresponding two-dimensional representation of the conductive vias.
10. The method according to claim 9 , wherein the determining which of the conductive components overlap locations of redundant vias comprises identifying where the conductive components and the conductive vias overlap when the two-dimensional representations of the adjacent layers and the corresponding two-dimensional representation of the conductive vias are aligned.
11. The method according to claim 8 , wherein the closed-loop rectangular geometric shapes comprise an unbroken loop rectangular of connected shapes where there are redundant vias, and
wherein the open-loop rectangular geometric shapes comprise a broken loop rectangular of disconnected shapes where there are not redundant vias.
12. The method according to claim 8 , wherein the closed-loop rectangular geometric shapes and open-loop rectangular geometric shapes are different from any shapes used to represent the devices or the conductive vias.
13. The method according to claim 8 , further comprising removing known shapes from the via checker data.
14. The method according to claim 8 , wherein the via checker data is not a layer of the IC design and is different from the different layers of the IC design.
15. A computerized device comprising:
a processor; and
an input/output electrically connected to the processor,
wherein the input/output receives an integrated circuit (IC) design,
wherein the IC design is of a three-dimensional structure and has devices on different layers electrically connected to each other by conductive vias extending between the different layers,
wherein the processor identifies relative locations of the conductive vias and of conductive components of the devices within adjacent layers of the different layers to transform the three-dimensional structure into two-dimensional representations,
wherein the conductive components run parallel and perpendicular to one another in the different layers,
wherein the processor determines which of the conductive components within the adjacent layers overlap redundant vias of the conductive vias,
wherein the processor generates via checker data of a combination of the adjacent layers that includes closed-loop rectangular geometric shapes representing each instance of the conductive components overlapping redundant vias, and includes open-loop rectangular geometric shapes representing each instance of the conductive components failing to have overlapping redundant vias,
wherein the input/output outputs the via checker data, and
wherein the open-loop rectangular geometric shapes in the via checker data provide data of locations in the IC design that fail to have redundant vias.
16. The computerized device according to claim 15 , wherein the processor identifies the relative locations of the conductive vias and of conductive components by aligning two-dimensional representations of the adjacent layers and a corresponding two-dimensional representation of the conductive vias.
17. The computerized device according to claim 16 , wherein the processor determines which of the conductive components overlap locations of redundant vias by identifying where the conductive components and the conductive vias overlap when the two-dimensional representations of the adjacent layers and the corresponding two-dimensional representation of the conductive vias are aligned.
18. The computerized device according to claim 15 , wherein the closed-loop rectangular geometric shapes comprise an unbroken loop rectangular of connected shapes where there are redundant vias, and
wherein the open-loop rectangular geometric shapes comprise a broken loop rectangular of disconnected shapes where there are not redundant vias.
19. The computerized device according to claim 15 , wherein the rectangular geometric shapes are different from any shapes used to represent the devices or the conductive vias.
20. The computerized device according to claim 15 , further the processor removes known shapes from the via checker data.