Power supply systems and methods for generating power with multiple amplifier paths
A power supply system includes a power converter configured to generate a high-frequency power signal and be connected to a load to supply a plasma process or gas laser process with power. The power converter includes at least one amplifier stage having first and second amplifier paths each having an amplifier. The first and second amplifier path are connected to a phase-shifting coupler unit that is configured to couple phase-shifted output signals from the first and second amplifier paths to form the high-frequency power signal. At least one amplifier of the first and second amplifier paths includes a field effect transistor implemented in a semiconductor device with a semiconductor structure having a substantially layered construction, and the semiconductor device includes a channel, a current flowing in the channel substantially in parallel with layers of the semiconductor structure.
1. A power supply system comprising:
a power converter configured to generate a high-frequency power signal and comprising:
at least one amplifier stage having first and second amplifier paths each having an amplifier, the first amplifier path outputting a first amplifier path output signal and the second amplifier path outputting a second amplifier path output signal that, with respect to the first amplifier path output signal, has a phase shift greater than 0° and less than 180°,
wherein the first and second amplifier paths are connected to a phase-shifting coupler unit that is configured to couple the first and second amplifier path output signals to form the high-frequency power signal,
wherein at least one amplifier of the first and second amplifier paths comprises a field effect transistor implemented in a semiconductor device with a semiconductor structure having a substantially layered construction,
wherein the semiconductor device comprises a channel, a current flowing in the channel substantially in parallel with layers of the semiconductor structure, and
wherein inductors of the phase-shifting coupler unit are arranged at least in portions in a plane, the semiconductor device with the transistor being arranged in the same plane or in a parallel plane.
2. The power supply system of claim 1 , wherein the semiconductor device is oriented such that the channel in which the current flows through the semiconductor device is oriented in the same plane or in the parallel plane.
3. The power supply system of claim 1 , wherein the inductors define a plurality of conductor paths that are arranged in the same plane or in a parallel plane.
4. The power supply system of claim 3 , wherein the inductors comprise first and second planar inductors that are thermally and capacitively coupled via a dielectric to an earth plane through which coolant flows and are simultaneously capacitively and inductively coupled to one another, and
wherein the first and second planar inductors have conductor path widths narrower than a predetermined width, such that the capacitive coupling between the conductor paths and the earth plane is kept under a predetermined value.
5. The power supply system of claim 1 , wherein the inductors have more than two windings and are formed without ferritic elements.
6. The power supply system of claim 1 , wherein at least one of the amplifier paths has an output network between the corresponding amplifier and the phase-shifting coupler unit.
7. The power supply system of claim 6 , wherein the output network has at least one planar inductor that is thermally and capacitively coupled via a dielectric to an earth plane through which coolant flows.
8. The power supply system of claim 6 , wherein at least one inductor of the output network is arranged at least in portions in the same plane or in a parallel plane.
9. The power supply system of claim 6 , wherein at least one inductor of the phase-coupling coupler unit and at least one inductor of the output network are arranged at least in portions on a layer of a circuit board.
10. The power supply system of claim 1 , wherein dimensions of the semiconductor device are configured such that a thickness of the semiconductor device is smaller than a wavelength of a signal to be amplified by more than two orders of magnitude, and a width or a depth of the semiconductor device or both is smaller than the wavelength of the signal to be amplified by more than one order of magnitude.
11. The power supply system of claim 1 , wherein the phase-shifting coupler unit comprises at least one coupler having a thickness smaller than a wavelength of a signal to be amplified by more than two orders of magnitude.
12. The power supply system of claim 1 , wherein the phase-shifting coupler unit comprises at least one coupler having a line length smaller than a wavelength of a signal to be amplified by more than one order of magnitude.
13. The power supply system of claim 1 , wherein the phase-shifting coupler unit comprises an absorption resistor configured for rapid pulsing between two output powers or for modulating an output power if phases of the first and second amplifier paths are changed with respect to one another.
14. The power supply system of claim 1 , wherein the semiconductor device has a first power terminal, a second power terminal, and a control terminal that are arranged on a first face of the semiconductor device, and
wherein the power supply system further comprises a power source terminal arranged on a second face of the semiconductor device opposite to the first face and configured to be electrically conductively connected to the first power terminal through the semiconductor device.
15. The power supply system of claim 14 , wherein the power source terminal is electrically conductively connected to the first power terminal by a heavily positively doped zone extending from the first face to the second face.
16. The power supply system of claim 1 , wherein the semiconductor device has a weakly negatively doped drift zone between a power terminal and a control terminal on a face of the semiconductor device facing the terminals, and
wherein the channel is below the control terminal, and a size of the weakly negatively doped drift zone is larger than a width of the channel.
17. The power supply system of claim 1 , wherein at least one of the amplifiers is configured such that an output impedance of the at least one of the amplifiers changes when an impedance to which the at least one of the amplifiers supplies its power changes.
18. The power supply system of claim 1 , wherein the transistor has a control input, to which a driving voltage is connected via a capacitive dissipative circuit unit that has a capacitive element including a resistor connected in parallel.
19. A power supply system comprising:
a power converter configured to generate a high-frequency power signal and comprising:
at least one amplifier stage having first and second amplifier paths each having an amplifier, the first amplifier path outputting a first amplifier path output signal and the second amplifier path outputting a second amplifier path output signal that, with respect to the first amplifier path output signal, has a phase shift greater than 0° and less than 180°,
wherein the first and second amplifier paths are connected to a phase-shifting coupler unit that is configured to couple the first and second amplifier path output signals to form the high-frequency power signal,
wherein at least one amplifier of the first and second amplifier paths comprises a field effect transistor implemented in a semiconductor device with a semiconductor structure having a substantially layered construction,
wherein the semiconductor device comprises a channel, a current flowing in the channel substantially in parallel with layers of the semiconductor structure,
wherein at least one of the amplifier paths has an output network between the corresponding amplifier and the phase-shifting coupler unit, and wherein at least one inductor of the phase-coupling coupler unit and at least one inductor of the output network are arranged at least in portions on a layer of a circuit board.
20. A high-frequency plasma system comprising:
a plasma chamber in which at least one electrode is arranged; and
a power supply system connected to the electrode and configured to supply high-frequency power to the electrode, the power supply system comprising:
at least one amplifier stage having first and second amplifier paths each having an amplifier, the first amplifier path outputting a first amplifier path output signal and the second amplifier path outputting a second amplifier path output signal that, with respect to the first amplifier path output signal, has a phase shift within a range from 0° to 180°,
wherein the first and second amplifier path are connected to a phase-shifting coupler unit that is configured to couple the first and second amplifier path output signals to form the high-frequency power signal,
wherein at least one amplifier of the first and second amplifier paths comprises a field effect transistor implemented in a semiconductor device with a semiconductor structure having a substantially layered construction,
wherein the semiconductor device comprises a channel, a current flowing in the channel substantially in parallel with layers of the semiconductor structure, and
wherein inductors of the phase-shifting coupler unit are arranged at least in portions in a plane, the semiconductor device of the transistor being arranged in the same plane or in a parallel plane.