Memories and memory components with interconnected and redundant data interfaces
A memory system includes dynamic random-access memory (DRAM) component that include interconnected and redundant component data interfaces. The redundant interfaces facilitate memory interconnect topologies that accommodate considerably more DRAM components per memory channel than do traditional memory systems, and thus offer considerably more memory capacity per channel, without concomitant reductions in signaling speeds. Each DRAM component includes multiplexers that allow either of the data interfaces to write data to or read data from a common set of memory banks, and to selectively relay write and read data to and from other components, bypassing the local banks. Delay elements can impose selected read/write delays to align read and write transactions from and to disparate DRAM components.
1. A memory module comprising:
a. a first memory package and a second memory package, each of the first memory package and the second memory package including:
i. a first memory component having a first data port and a second data port; and
ii. a second memory component having a first data port and a second data port;
iii. wherein the second data port of the first memory component is connected to the second data port of the second memory component;
b. a module connector having:
i. a first module data connection connected to the first data port of the first memory component of the first memory package; and
ii. a second module data connection connected to the first data port of the first memory component of the second memory package;
c. a first data link extending between the first data port of the second memory component of the first memory package and the second data port of the second memory component of the second memory package;
d. a third memory package and a fourth memory package, each of the third memory package and the fourth memory package including:
i. a first memory component having a first data port and a second data port; and
ii. a second memory component having a first data port and a second data port;
iii. wherein the second data port of the first memory component is connected to the second data port of the second memory component;
e. a second data link extending between the second data port of the first memory component of the first memory package and the second data port of the first memory component of the third memory package;
f. a third data link extending between the first data port of the first memory component of the third memory package and the first data port of the first memory component of the fourth memory package; and
g. a fourth data link extending between the second data port of the first memory component of the fourth memory package and the first data port of the second memory component of the second memory package.
2. The memory module of claim 1 , further comprising a fifth data link extending between the first data port of the first memory component of the third memory package and the first data port of the first memory component of the fourth memory package.
3. The memory module of claim 1 , wherein the third memory package is configured to convey read data to the first memory package via the second data link.
4. The memory module of claim 3 , wherein the fourth memory package is configured to convey second read data to the third memory package via the third data link.
5. The memory module of claim 3 , wherein the second memory package is configured to convey read data to the first memory package via the first data link.
6. The memory module of claim 1 , further comprising a first command link connected to the first memory package and a second command link connected to the second memory package.
7. The memory module of claim 6 , wherein the first command link is connected to each of the first memory component and the second memory component in the first memory package and the second command link is connected to each of the first memory component and the second memory component in the second memory package.
8. The memory module of claim 6 , further comprising a buffer component coupled to the first command link and the second command link.
9. The memory module of claim 1 , the first memory component and the second memory component each comprising a DRAM memory bank.
10. The memory module of claim 1 , each memory component having a memory bank and a configurable delay element disposed between the memory bank and at least one of the first data port and the second data port.
11. A memory module comprising:
a. a first memory package and a second memory package, each of the first memory package and the second memory package including:
i. a first memory component having a first data port and a second data port; and
ii. a second memory component having a first data port and a second data port;
iii. wherein the second data port of the first memory component is connected to the second data port of the second memory component;
b. a module connector having:
i. a first module data connection connected to the first data port of the first memory component of the first memory package; and
ii. a second module data connection connected to the first data port of the first memory component of the second memory package; and
c. a first data link extending between the first data port of the second memory component of the first memory package and the second data port of the second memory component of the second memory package;
d. each memory component having a memory bank, a configurable delay element disposed between the memory bank and at least one of the first data port and the second data port, and a multiplexer having a first multiplexer input coupled to the first data port, a second multiplexer input coupled to the second data port, and a multiplexer output coupled to the memory bank.
12. A memory module comprising:
a. a first memory package and a second memory package, each of the first memory package and the second memory package including:
i. a first memory component having a first data port and a second data port; and
ii. a second memory component having a first data port and a second data port;
iii. wherein the second data port of the first memory component is connected to the second data port of the second memory component;
b. a module connector having:
i. a first module data connection connected to the first data port of the first memory component of the first memory package; and
ii. a second module data connection connected to the first data port of the first memory component of the second memory package; and
c. a first data link extending between the first data port of the second memory component of the first memory package and the second data port of the second memory component of the second memory package;
d. wherein the first data port of the first memory component of the second memory package is disabled.
13. The memory module of claim 12 , wherein the second memory package is configured to convey read data to the first memory package via the first data link.