IP Library › Granted Patent US 1,039,966
Granted Patent S1
US 1,039,966 · App. 29/929,886 · Granted Aug 27, 2024

Package

Inventors: Hyunjun Yang (Seoul, KR); Yunhwan Kim (Seoul, KR); Deokhun Moon (Seoul, KR); Goeun Lee (Seoul, KR)
Assignee: SPIGEN KOREA CO., LTD.
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Quick Facts
Patent No.
US 1,039,966
App. No.
29/929,886
Granted
Aug 27, 2024
Kind
S1
Claims (1)

We claim the ornamental design for a package, as shown and described.

Continuity (1)
Division 29652365 · Jul 28, 2020