Electronic device and manufacturing method thereof
An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of an electronic device includes following steps: forming a flexible substrate on a rigid carrier plate; forming at least a thin-film device on the flexible substrate; forming a conductive line on the flexible substrate, wherein the conductive line is electrically connected with the thin-film device; forming at least an electrical connection pad on the flexible substrate, wherein the electrical connection pad is electrically connected with the conductive line, and the thickness of the electrical connection pad is between 2 and 20 microns; disposing at least a surface-mount device (SMD) on the flexible substrate, wherein the SMD is electrically connected with the thin-film device through the electrical connection pad and the conductive line; and removing the rigid carrier plate.
1. An electronic device, comprising:
a flexible circuit board, comprising:
a flexible substrate,
a conductive line disposed on the flexible substrate, and
at least an electrical connection pad disposed on the flexible substrate and electrically connected with the conductive line, wherein a thickness of the electrical connection pad is between 2 microns and 20 microns;
at least a thin-film device formed on the flexible substrate and electrically connected with the conductive line; and
at least a surface-mount device (SMD) directly mounted on the flexible substrate, wherein the SMD is electrically connected with the thin-film device through the electrical connection pad and the conductive line.
2. The electronic device according to claim 1 , wherein the flexible substrate comprises an organic polymer material, and a glass transition temperature of the organic polymer material is between 400° C. and 600° C.
3. The electronic device according to claim 1 , wherein a width of the conductive line is between 1 microns and 10 microns.
4. The electronic device according to claim 1 , wherein the thin-film device is a semiconductor device.
5. The electronic device according to claim 1 , wherein the flexible substrate comprises an active region and a periphery region, the thin-film device is located in the active region, and the SMD is located in the periphery region for driving the thin-film device.
6. The electronic device according to claim 5 , wherein the electronic device comprises a plurality of thin-film devices forming a sensing pixel array.
7. The electronic device according to claim 1 , wherein the flexible substrate comprises an active region, and the thin-film device and the SMD are located in the active region.
8. The electronic device according to claim 7 , wherein the electronic device comprises a plurality of thin-film devices and a plurality of SMDs, and the thin-film devices and the SMDs form a sensing pixel array.
9. The electronic device according to claim 8 , wherein the thin-film device comprises at least a thin-film transistor, and the SMD comprises at least an LED chip.
10. A manufacturing method of an electronic device, comprising steps of:
forming a flexible substrate on a rigid carrier plate;
forming at least a thin-film device on the flexible substrate;
forming a conductive line on the flexible substrate, wherein the conductive line is electrically connected with the thin-film device;
forming at least an electrical connection pad on the flexible substrate, wherein the electrical connection pad is electrically connected with the conductive line, and a thickness of the electrical connection pad is between 2 microns and 20 microns;
directly mounting at least a surface-mount device (SMD) on the flexible substrate by surface-mount technology, wherein the SMD is electrically connected with the thin-film device through the electrical connection pad and the conductive line; and
removing the rigid carrier plate.
11. The manufacturing method according to claim 10 , wherein the flexible substrate comprises an organic polymer material, and a glass transition temperature of the organic polymer material is between 400° C. and 600° C.
12. The manufacturing method according to claim 10 , wherein the flexible substrate is disposed by gluing or dispensing and is then cured so as to be formed on the rigid carrier plate.
13. The manufacturing method according to claim 10 , wherein the electrical connection pad is formed by a plating, printing, or evaporation process and a lift-off patterning process.
14. The manufacturing method according to claim 10 , wherein the conductive line is formed by a copper foil pressing process and an etching process or by a thin film process.
15. The manufacturing method according to claim 14 , wherein the thin film process comprises a low-temperature polycrystalline silicon process, an amorphous silicon process, or a metal oxide semiconductor process.
16. An electronic device, comprising:
a flexible circuit board, comprising:
a flexible substrate,
a conductive line disposed on the flexible substrate, and
at least an electrical connection pad disposed on the flexible substrate and electrically connected with the conductive line, wherein a thickness of the electrical connection pad is between 2 microns and 20 microns;
at least a thin-film device disposed on the flexible substrate and electrically connected with the conductive line; and
at least a surface-mount device (SMD) disposed on the flexible substrate, wherein the SMD is electrically connected with the thin-film device through the electrical connection pad and the conductive line;
wherein the flexible substrate comprises an active region and a periphery region, the thin-film device is located in the active region, and the SMD is located in the periphery region for driving the thin-film device.
17. The electronic device according to claim 16 , wherein the electronic device comprises a plurality of thin-film devices forming a sensing pixel array.