IP Library Granted Patent US 10,408,780
Granted Patent B2
US 10,408,780 · App. 15/493,120 · Granted Sep 10, 2019

Structure of gas sensor

Inventors: Chia-Wei Lee (Kaohsiung, TW); Chang-Sheng Hsu (Hsinchu, TW); Chih-Fan Hu (Taoyuan, TW); Chin-Jen Cheng (Zhubei, TW); Chang Hsin Wu (Zhudong Township, TW)
Assignee: UNITED MICROELECTRONICS CORPORATION
G01N27/128
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Quick Facts
Patent No.
US 10,408,780
App. No.
15/493,120
Granted
Sep 10, 2019
Kind
B2
Abstract

The present invention provides a structure of a gas sensor, comprising: a support, having a front side, a back side opposite to the front side, a cell region, and a peripheral region circling the cell region; a cavity, formed on the back side of the support in the cell region; a heater, disposed on the front side of the support covering the cavity; a sensing element, disposed on the heater; and a sealing layer, formed on the back side of the support covering inside the cavity.

Claims (16)

1. A structure of a gas sensor, comprising:

a support, having a front side, a back side opposite to the front side, a cell region, and a peripheral region circling the cell region, wherein the support comprises a silicon layer at the back side and an oxide layer adjacent to the silicon layer at the front side;

a cavity, formed on the back side of the support in the cell region;

a heater, disposed on the front side of the support covering the cavity;

a sensing element, disposed on the heater;

an interconnect structure formed in the oxide layer in the peripheral region, wherein the interconnect structure comprises a plurality of interconnect metal layers; and

a sealing layer, formed on the back side of the support covering inside the cavity, wherein the sealing layer conformally covers on the back side of the support and in the cavity.

2. The structure of the gas sensor according to claim 1 , wherein the silicon layer is a crystalline silicon layer having a thickness in a range of 290-450 micrometers.

3. The structure of the gas sensor according to claim 2 , wherein the thickness of the silicon layer is in a range of 350-400 micrometers.

4. The structure of the gas sensor according to claim 1 , wherein the oxide layer has a thickness in a range of 6-50 micrometers.

5. The structure of the gas sensor according to claim 1 , wherein the sealing layer has a thickness in a range of 500-10000 angstroms.

6. The structure of the gas sensor according to claim 1 , wherein the sealing layer has a thickness in a range of 1000-6000 angstroms.

7. The structure of the gas sensor according to claim 1 , wherein a material of the sealing layer is selected from silicon nitride and polyamide.

8. The structure of the gas sensor according to claim 1 , wherein the heater is embedded in a dielectric layer, and the dielectric layer is disposed directly on the support.

9. The structure of the gas sensor according to claim 1 , wherein a depth of the cavity is in a range of 300-500 micrometers.

10. The structure of the gas sensor according to claim 1 , wherein a diameter of the cavity is in a range of 250-700 micrometers.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2017
From: LEE, CHIA-WEI; HSU, CHANG-SHENG; HU, CHIH-FAN; CHENG, CHIN-JEN; WU, CHANG HSIN
To: UNITED MICROELECTRONICS CORPORATION
Reel/Frame 042087/0629 →
Continuity (1)
Related Publication 20180306738A1 · Oct 25, 2018