IP Library Granted Patent US 10,412,995
Granted Patent B2
US 10,412,995 · App. 14/955,701 · Granted Sep 17, 2019

E-vapor device including puncture device and sealed packet of pre-vapor formulation

Inventor: Jason Andrew Macko (Richmond, VA)
Assignee: Altria Client Services LLC
A24F47/008H05B1/0244H05B3/0014
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Quick Facts
Patent No.
US 10,412,995
App. No.
14/955,701
Granted
Sep 17, 2019
Kind
B2
Abstract

An e-vapor device may include a housing shell configured to receive a supply packet containing a pre-vapor formulation, a mouthpiece secured to an end of the housing shell, a puncture device within the housing shell, and a heater structure within the housing shell and arranged to be in thermal contact with the pre-vapor formulation. The mouthpiece is configured to transition from a protracted position to a retracted position. The puncture device is configured to pierce the supply packet to release the pre-vapor formulation when the mouthpiece transitions to the retracted position. The heater structure is configured to vaporize the pre-vapor formulation to generate a vapor.

Claims (32)

1. An e-vapor device, comprising:

a housing shell configured to receive a supply packet containing a pre-vapor formulation;

a mouthpiece secured to an end of the housing shell, the mouthpiece configured to transition from a protracted position to a retracted position;

a puncture device within the housing shell, the puncture device configured to pierce the supply packet to release the pre-vapor formulation when the mouthpiece transitions to the retracted position, the mouthpiece configured to compress the supply packet so as to cause a discharge of the pre-vapor formulation therefrom when the mouthpiece transitions to the retracted position; and

a heater structure within the housing shell and arranged to be in thermal contact with the pre-vapor formulation, the heater structure configured to vaporize the pre-vapor formulation to generate a vapor.

2. The e-vapor device of claim 1 , wherein the supply packet has an annular form.

3. The e-vapor device of claim 1 , wherein the supply packet is hermetically-sealed.

4. The e-vapor device of claim 1 , wherein the mouthpiece is configured to transition irreversibly to the retracted position.

5. The e-vapor device of claim 1 , wherein the mouthpiece has a plunger portion that is configured to slide into the housing shell during the transition to the retracted position.

6. The e-vapor device of claim 5 , wherein the plunger portion is configured to lock in place when the retracted position is reached.

7. The e-vapor device of claim 1 , wherein the supply packet has accordion sidewalls that are configured to collapse when the mouthpiece transitions to the retracted position.

8. The e-vapor device of claim 1 , wherein the puncture device is in a form of a plurality of puncture pins, each of the plurality of puncture pins including a base portion and a pointed portion on the base portion, the pointed portion configured to pierce the supply packet, the base portion configured to halt a penetration of the pointed portion into the supply packet and to support the supply packet after being pierced by the pointed portion.

9. The e-vapor device of claim 1 , wherein the puncture device is in a form of a porous plate with a plurality of pointed protrusions on a surface of the porous plate facing the supply packet.

10. The e-vapor device of claim 1 , further comprising:

a spring positioned between the mouthpiece and the supply packet, the mouthpiece configured to compress the spring when transitioning to the retracted position so as to provide a stored energy that yields a compressive force on the supply packet.

11. The e-vapor device of claim 10 , wherein the compressive force pushes the supply packet against the puncture device to pierce the supply packet and to discharge the pre-vapor formulation from the supply packet.

12. The e-vapor device of claim 10 , further comprising:

a diffuser plate positioned between the spring and the supply packet, the diffuser plate configured to distribute the compressive force over a surface of the diffuser plate.

13. A method of improving a shelf-life of a pre-vapor formulation for an e-vapor device, the method comprising:

arranging a supply packet within a housing shell of the e-vapor device so as to be between a mouthpiece secured to an end of the housing shell and a puncture device within the housing shell, the supply packet containing the pre-vapor formulation, the mouthpiece configured to transition from a protracted position to a retracted position, the puncture device configured to pierce the supply packet to release the pre-vapor formulation when the mouthpiece transitions to the retracted position, the mouthpiece configured to compress the supply packet so as to cause a discharge of the pre-vapor formulation therefrom when the mouthpiece transitions to the retracted position such that the pre-vapor formulation comes into thermal contact with a heater structure within the housing shell, the heater structure configured to vaporize the pre-vapor formulation to generate a vapor.

14. The method of claim 13 , further comprising:

forming the supply packet into an annular form prior to the arranging.

15. The method of claim 13 , further comprising:

hermetically sealing the pre-vapor formulation within the supply packet prior to the arranging.

16. The method of claim 15 , wherein the hermetically sealing includes heat sealing the pre-vapor formulation within a polymer-coated metal foil.

17. The method of claim 13 , further comprising:

pressing the mouthpiece to transition from the protracted position to the retracted position to activate the e-vapor device.

18. The method of claim 17 , further comprising:

squeezing the supply packet with a stored energy provided by a compression of a spring so as to discharge the pre-vapor formulation based on a deformation of the supply packet caused by a decompression of the spring.

19. The e-vapor device of claim 1 , wherein the housing shell defines a chamber configured to receive the supply packet, the mouthpiece configured to slide into the housing shell to compress the supply packet and to reduce a volume of the chamber.

20. The e-vapor device of claim 1 , further comprising:

an absorbent material within the housing shell, the absorbent material configured to absorb the pre-vapor formulation discharged from the supply packet.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2015
From: MACKO, JASON ANDREW
To: ALTRIA CLIENT SERVICES LLC
Reel/Frame 037240/0873 →
Continuity (1)
Related Publication 20170150753A1 · Jun 1, 2017
Cited By (1)
US 12,690,613