IP Library Granted Patent US 1,043,024
Granted Patent S1
US 1,043,024 · App. 29/830,024 · Granted Sep 17, 2024

Material conveying groove

Inventors: Mikio Kishikawa (Kyoto, JP); Ryo Ichihashi (Kyoto, JP); Takahide Kasugai (Kyoto, JP); Michio Nishi (Kyoto, JP)
Assignee: Ishida Co., Ltd.
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Quick Facts
Patent No.
US 1,043,024
App. No.
29/830,024
Granted
Sep 17, 2024
Kind
S1
Claims (1)

The ornamental design for a material conveying groove, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2022
From: KISHIKAWA, MIKIO; ICHIHASHI, RYO; KASUGAI, TAKAHIDE; NISHI, MICHIO
To: ISHIDA CO., LTD.
Reel/Frame 059357/0516 →
Priority Claims (1)
CN 202130601624.X · Sep 10, 2021 · national