IP Library › Granted Patent US 1,043,118
Granted Patent S1
US 1,043,118 · App. 29/838,543 · Granted Sep 24, 2024

Cover for earphone case

Inventors: Bum Joon Lee (Seoul, KR); Kwang Min Yuk (Seoul, KR)
Assignee: Hamee Global Inc.
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Quick Facts
Patent No.
US 1,043,118
App. No.
29/838,543
Granted
Sep 24, 2024
Kind
S1
Claims (1)

The ornamental design for a cover for earphone case, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2022
From: LEE, BUM JOON; YUK, KWANG MIN
To: HAMEE GLOBAL INC.
Reel/Frame 059900/0505 →
Priority Claims (1)
KR 30-2021-0055807 · Nov 22, 2021 · national