Disk tray for non-volatile memory express over fabric solid state drive
A non-volatile memory express over fabric solid state drive mounting device detachably connected to an outer support frame, having a thermally conductive tray, a left support wall demountably connected to the tray, the left support wall having a left guide groove, a right support wall demountably connected to the tray, the right support wall having a right guide groove, a disk slidably engaged within the left support wall left guide groove and the right support wall right guide groove, a circuit board having at least one component, the circuit board demountably connected to the tray and detachably engaged to the disk drive and a flexible heat dissipation pad contacting the at least one component and detachably contacting the tray.
1. A non-volatile memory express over fabric solid state drive mounting device detachably connected to an outer support frame, comprising:
a thermally conductive tray;
a left support wall demountably connected to the tray, the left support wall having a left guide groove;
a right support wall demountably connected to the tray, the right support wall having a right guide groove;
a disk drive slidably engaged within the left support wall left guide groove and the right support wall right guide groove;
a circuit board having at least one component, the circuit board demountably connected to the tray and detachably engaged to the disk drive;
a flexible heat dissipation pad contacting the at least one component and detachably contacting the tray;
a thermal dissipation extension which is an integrated part of the thermally conductive tray;
wherein said flexible heat dissipation pad is fastened at a fixed position of the tray next to said thermal dissipation extension:
wherein said circuit board is installed in said guide grooves on the left and right support walls, and a processor on the circuit board is aligned with the flexible heat dissipation pad, so that the processor mates to the flexible heat dissipation pad; and
wherein said disk drive is installed on the tray and locked with a plurality of retention screws on both sides.
2. The non-volatile memory express over fabric solid state drive mounting device of claim 1 wherein the flexible heat dissipation pad provides vibration reduction to the circuit board.
3. The non-volatile memory over fabric solid state drive mounting device of claim 1 wherein mounting device conducts thermal energy from the tray to the outer support frame upon insertion of the mounting device to the outer support frame.
4. The non-volatile memory over fabric solid state drive mounting device of claim 1 further comprising spring tabs connected to the tray.
5. The non-volatile memory over fabric solid state drive mounting device of claim 1 wherein the tray having air convection slots.
6. The non-volatile memory express over fabric solid state drive mounting device of claim 1 wherein the at least one component comprises a processor electrically connected to the circuit board.
7. The non-volatile memory over fabric solid state drive mounting device of claim 1 wherein the tray is an aluminum alloy.
8. The non-volatile memory over fabric solid state drive mounting device of claim 1 wherein the mounting device is sized to fit a 2RU (rack unit) space.
9. The non-volatile memory over fabric solid state drive mounting device of claim 1 further comprising an Ethernet interface connected to the circuit board.
10. A non-volatile memory over fabric solid state drive mounting device detachably connected to an outer support frame, comprising:
a thermally conductive tray having a left support wall and a right support wall;
a disk drive slidably engaged within the left support wall and the right support wall;
a circuit board having at least one component, the circuit board demountably connected to the tray and detachably engaged to the disk drive;
a flexible heat dissipation pad contacting the at least one component and detachably contacting the tray;
a thermal dissipation extension which is an integrated part of the thermally conductive tray; and
wherein said flexible heat dissipation pad is fastened at a fixed position of the tray next to said thermal dissipation extension; and
wherein said circuit board is installed in a guide groove on the left and right support walls, and a processor on the circuit board is aligned with the flexible heat dissipation pad, so that the processor mates to the flexible heat dissipation pad.
11. The non-volatile memory over fabric solid state mounting device of claim 10 further comprising spring tabs connected to the tray.
12. The non-volatile memory over fabric solid state mounting device of claim 10 wherein the tray having air convection slots.
13. The non-volatile memory over fabric solid state mounting device of claim 10 wherein the at least one component comprises a processor electrically connected to the circuit board.
14. The non-volatile memory over fabric solid state mounting device of claim 10 wherein the at least one component comprises an Ethernet switch electrically connected to the circuit board.
15. The non-volatile memory over fabric solid state mounting device of claim 10 wherein the tray is an aluminum alloy.
16. The non-volatile memory over fabric solid state mounting device of claim 10 wherein the mounting device is sized to fit a 2U space.
17. The non-volatile memory over fabric solid state mounting device of claim 10 wherein the mounting device is less than 17.6 mm in height.
18. The non-volatile memory over fabric solid state mounting device of claim 10 further comprising an Ethernet interface connected to the circuit board.