Method of manufacturing a display panel capable of preventing a defect in light emission of an organic light emitting element
A display panel includes an auxiliary electrode on a base substrate, a first electrode spaced from the auxiliary electrode, a first light emitting unit on the auxiliary electrode and the first electrode, an conductive thin film layer on the first light emitting unit, a second light emitting unit on the conductive thin film layer, a first contact hole through the conductive thin film layer to expose the auxiliary electrode, a insulating layer in the first contact hole, and a second electrode including a first electrode part and a second electrode part, the first electrode part being on the insulating layer in the first contact hole, and the second electrode part overlapping the first electrode and being on the second light emitting unit, wherein the insulating layer is between the first electrode part and the conductive thin film layer.
1. A method of manufacturing a display panel, the method comprising:
forming an auxiliary electrode in a first area defined in a base substrate;
forming a first electrode in a second area defined in the base substrate and spaced apart from the first area when viewed in a plan view;
forming a first light emitting unit on the first electrode;
forming an conductive thin film layer on the first light emitting unit;
forming a second light emitting unit on the conductive thin film layer;
removing at least a portion of the first light emitting unit, the conductive thin film layer, and the second light emitting unit to form a first contact hole through which an upper surface of the auxiliary electrode is exposed;
forming a insulating layer on an exposing surface of the conductive thin film layer, which is exposed through the first contact hole; and
forming a second electrode on the insulating layer.
2. The method as claimed in claim 1 , further comprising removing a portion of the insulating layer to form a second contact hole, through which at least a portion of the upper surface of the auxiliary electrode is exposed, through the insulating layer.
3. The method as claimed in claim 2 , wherein forming the second contact hole is performed after forming the insulating layer and before forming the second electrode.
4. The method as claimed in claim 1 , wherein the first light emitting unit, the conductive thin film layer, and the second light emitting unit are removed using a laser drilling method.