Offset interposers for large-bottom packages and large-die package-on-package structures

1. An interposer, comprising:

a land side including land-side ball-grid array (BGA) including land-side pads, wherein the land-side BOA is configured to interface with a first-level interconnect; and

a package-on-package (POP) side including a POP-side BOA including POP-side pads,

wherein the POP-side BOA is configured to interface with a POP interconnect, wherein the land-side pads are coupled to the POP-side pads through the interposer,

wherein the land-side pads have a different footprint than the respective POP-side pads,

wherein the land side pads are configured at a first pitch and the POP-side pads are configured at a second pitch

wherein the land-side pads have a first perimeter dimension and the POP-side pads have a second perimeter dimension, wherein the first perimeter dimension is larger than the second perimeter dimension, and

wherein the POP-side pads include a first set of POP-side pads located on a first side of an interposer through hole and a second set of POP-side pads located on a second side of the interposer through hole, and along a first cross-section of the interposer, a number of pads in the first set of POP-side pads is greater than a number of pads in the second set of POP-side pads.

2. The interposer of claim 1 , wherein a given land-side pad is coupled to the corresponding POP-side pad by direct contact with a via.

3. The interposer of claim 1 , wherein along a second cross section of the interposer, the number of pads in the first set of POP-side pads is less than the number of in the second set of POP-side pads.

4. The interposer of claim 1 , wherein the different footprint of the land-side pads is exclusive of the footprint of the POP-side pads, and wherein the first pitch is smaller than the second pitch.

5. The interposer of claim 1 , wherein the different footprint of the land-side pads is a less than 50 percent overlap.

6. The interposer of claim 1 , wherein the different footprint of the land-side pads is a less than 50 percent overlap, and wherein a given land-side pad is coupled to the corresponding POP-side pad by direct contact with a via.

7. The interposer of claim 1 , wherein the different footprint of the land-side pads is a less than 50 percent overlap, wherein the land-side pads are configured at a first pitch, wherein the POP-side pads are configured at a second pitch, and wherein the first pitch is smaller than the second pitch.

8. The interposer of claim 1 , wherein the land-side pads are part of an array of land-side pads that are all configured at the first pitch, wherein the POP-side pads are part of an array of POP-side pads that are all configured at the second pitch, and wherein the first pitch is smaller than the second pitch.

9. The interposer of claim 1 , wherein the first pitch is the same as the second pitch.

10. The interposer of claim 1 , wherein the second pitch is on 0.5 mm centers and the first pitch is on 0.4 mm centers.

11. A package-on-package (POP) chip package comprising:

An offset interposer including:

a land side including land-side ball-grid array (BGA) including land-side pads, wherein the land-side BGA is configured to interface with a first-level interconnect; and

a package-on-package (POP) side including a POP-side BGA including POP-side pads,

wherein the POP-side BGA is configured to interface with a POP interconnect,

wherein the land-side pads are coupled to the POP-side pads through the interposer

wherein the land-side pads each have a different footprint than the respective POP-side pads, and wherein the land side pads are configured at a first pitch and the POP-side pads are configured at a second pitch,

wherein the land-side pads have a first perimeter dimension and the POP-side pads have a second perimeter dimension, wherein the first perimeter dimension is larger than the second perimeter dimension, and

wherein the POP-side pads include a first set of POP-side pads located on a first side of an interposer through hole and a second set of POP-side pads located on a second side of the interposer through hole, and along a first cross-section of the interposer, a number of pads in the first set of POP-side pads is greater than a number of pads in the second set of POP-side pads;

a POP substrate coupled to POP interconnects on the POP-side BGA; and

a microelectronic device disposed on the POP substrate, wherein the microelectronic device is electrically coupled to the offset interposer through the POP substrate.

12. The POP chip package 11 , wherein a given land-side pad is coupled to corresponding POP-side pad by direct contact with a via.

13. The POP chip package of claim 11 , wherein the different footprint of the two land-side pads is exclusive of the footprint of the two POP-side pads.

14. The POP chip package of claim 11 , wherein the different footprint of the land-side pads is exclusive of the footprint of the POP-side pads, and wherein the first pitch is smaller than the second pitch.

15. The POP chip package of claim 11 , wherein the two adjacent; spaced-apart land-side pads are configured at a first pitch, wherein the two adjacent, spaced-apart POP-side pads are configured at a second pitch, further including the die-side BGA is arranged with alternating two- and three-pad occurrences and the land-side BGA is arranged only with two-pad occurrences.

16. The POP chip package of claim 11 , wherein the microelectronic device is flip-chip disposed upon the POP substrate.

17. The POP chip package of claim 11 , further including:

a first-level interconnect coupled to the land side of the offset interposer; and

an electronic device mounted on the first-level interconnect.

18. The POP chip package of claim 11 , further including:

a first-level interconnect coupled to the land side of the offset interposer;

an electronic device mounted on the first-level interconnect; and

a stacked die mounted on the electronic device.

19. The POP chip package of claim 11 , further including:

a first-level interconnect coupled to the land side of the offset interposer;

an electronic device mounted on the first-level interconnect; and

a wire-bonded stacked die mounted on the electronic device.

20. The POP chip package of claim 11 , further including:

a first-level interconnect coupled to the land side of the offset interposer;

an electronic device mounted on the first-level interconnect; and

a through-silicon via stacked die mounted on the electronic device.

21. A process of building an offset interposer, comprising:

forming a land side including land-side ball-grid array (BGA) including land-side pads; wherein the land-side BGA is configured to interface with a first-level interconnect; and

forming a package-on-package (POP) side including a POP-side BGA including POP-side pads,

wherein the POP-side BGA is configured to interface with a POP interconnect, wherein the land-side pads are coupled to the POP-side pads through the interposer,

wherein the land-side pads have a different footprint than the POP-side pads,

wherein the land side pads are configured at a first pitch and the POP-side pads are configured at a second pitch

wherein the land-side pads have a first perimeter dimension and the POP-side pads have a second perimeter dimension; wherein the first perimeter dimension is larger than the second perimeter dimension

wherein the POP-side pads include a first set of POP-side pads located on a first side of an interposer through hole and a second set of POP-side pads located on a second side of the interposer through hole, and along a first cross-section of the interposer, a number of pads in the first set of POP-side pads is greater than a number of pads in the second set of POP-side pads.

22. The process of claim 21 , wherein the different footprint of the land-side pads is formed to be exclusive of the footprint of the POP-side pads, and wherein the first pitch is smaller than the second pitch.

23. The process of claim 21 , further including a method of assembling the offset interpose to a first-level interconnect.

24. The process of claim 21 , further including a method of assembling the offset interposer to a POP substrate.