High-power packaged laser array
A high-power packaged laser array that is thermal reflow compatible is described. Notably, a high-power III-V laser array is integrated on a silicon substrate with a matching array of ball lenses, an isolator and a coupler (such as a reflective layer) to achieve an edge-coupled or a surface-normal output laser array. In some embodiments, an isolator with a permanent magnet is used to preserve the magnetic domain or state of the isolator during the thermal reflow(s), which can involve temperatures up to 250 C. In order to relax the misalignment tolerance when integrating with the silicon chip, a laser array with a larger optical mode may be used to increase the output beam size. Moreover, a III-V laser array with an angled output optical waveguide can be used to improve the stability of the lasers at high power.
1. A packaged laser array, comprising:
a substrate having a surface;
a laser array, with one or more lasers, disposed on the surface, wherein the one or more lasers are configured to output one or more optical signals in a plane;
a lens array, with one or more lenses, disposed on the surface, wherein the one or more lenses are configured to refract the one or more optical signals;
an isolator, having a magnetization, configured to rotate a polarization of the one or more optical signals;
a permanent magnet, proximate to the isolator, configured to at least partially maintain the magnetization, wherein the permanent magnet has a non-zero remnant magnetization and is configured to maintain the magnetization of the isolator during thermal reflow of the packaged laser array without subsequent remagnetization of the isolator by providing an external magnetic field exceeding a saturation magnetic field of the magnetization in the isolator at a temperature exceeding 200 C; and
one or more couplers configured to couple the one or more optical signals out of the packaged laser array.
2. The packaged laser array of claim 1 , wherein the one or more couplers include one or more reflective layers and the one or more optical signals are coupled along a direction that is approximately perpendicular to the plane.
3. The packaged laser array of claim 1 , wherein the laser array comprises an external laser array on a different substrate that the substrate, which is coupled to the surface of the substrate.
4. The packaged laser array of claim 1 , wherein the one or more lenses comprises one or more ball lenses that are disposed in one or more corresponding pits in the surface.
5. The packaged laser array of claim 1 , wherein the packaged laser array comprises a half-wave plate between the isolator and the one or more couplers.
6. The packaged laser array of claim 1 , wherein the one or more optical signals have an optical beam size greater than 1 μm.
7. The packaged laser array of claim 1 , wherein the one or more lasers have angled facets.
8. The packaged laser array of claim 7 , wherein the lens array is arranged with an angle corresponding the angled facets and the one or more couplers are positioned based at least in part on the angled facets so that the one or more optical signals have approximately a common optical path length in the packaged laser array.
9. The packaged laser array of claim 1 , wherein the one or more optical signals have different carrier or fundamental wavelengths.
10. An electronic device, comprising a packaged laser array, wherein the packaged laser array comprises:
a substrate having a surface;
a laser array, with one or more lasers, disposed on the surface, wherein the one or more lasers are configured to output one or more optical signals in a plane;
a lens array, with one or more lenses, disposed on the surface, wherein the one or more lenses are configured to refract the one or more optical signals;
an isolator, having a magnetization, configured to rotate a polarization of the one or more optical signals;
a permanent magnet, proximate to the isolator, configured to at least partially maintain the magnetization, wherein the permanent magnet has a non-zero remnant magnetization and is configured to maintain the magnetization of the isolator during thermal reflow of the packaged laser array without subsequent remagnetization of the isolator by providing an external magnetic field exceeding a saturation magnetic field of the magnetization in the isolator at a temperature exceeding 200 C; and
one or more couplers configured to couple the one or more optical signals out of the packaged laser array.
11. The electronic device of claim 10 , wherein the laser array comprises an external laser array on a different substrate that the substrate, which is coupled to the surface of the substrate.
12. The electronic device of claim 10 , wherein the packaged laser array comprises a half-wave plate between the isolator and the one or more couplers.
13. The electronic device of claim 10 , wherein the one or more optical signals have an optical beam size greater than 1 μm.
14. The electronic device of claim 10 , wherein the electronic device comprises an integrated circuit that includes one or more optical waveguides and one or more couplers configured to optically couple the one or more optical signals into the one or more optical waveguides.
15. The electronic device of claim 10 , wherein the one or more lasers have angled facets.
16. The electronic device of claim 15 , wherein the lens array is arranged with an angle corresponding the angled facets and the one or more couplers are positioned based at least in part on the angled facets so that the one or more optical signals have approximately a common optical path length in the packaged laser array.
17. A method for providing one or more optical signals, comprising:
by a packaged laser array:
providing the one or more optical signals in a plane using a laser array with one or more lasers;
refracting the one or more optical signals using a lens array with one or more lenses;
rotating a polarization of the one or more optical signals using an isolator having a magnetization;
at least partially maintaining the magnetization using a permanent magnet, proximate to the isolator, wherein the permanent magnet has a non-zero remnant magnetization and maintains the magnetization of the isolator during thermal reflow of the packaged laser array without subsequent remagnetization of the isolator by providing an external magnetic field exceeding a saturation magnetic field of the magnetization in the isolator at a temperature exceeding 200 C; and
coupling the one or more optical signals along a direction out of the packaged laser array using one or more couplers.
18. The method of claim 17 , wherein the one or more couplers include one or more reflective layers and the one or more optical signals are coupled along a direction that is approximately perpendicular to the plane.
19. The method of claim 17 , wherein the laser array comprises an external laser array on a different substrate that the substrate, which is coupled to the surface of the substrate.
20. The method of claim 17 , wherein the packaged laser array comprises a half-wave plate between the isolator and the one or more couplers.