OLED device encapsulating method and structure, OLED device, and display screen
View Patent ↗A method for encapsulating an OLED device includes providing a substrate on which a barrier layer is formed; forming a surface active layer that includes multiple strips on the barrier layer; forming buffer strips on the surface active layer to correspond, in a one-to-one manner, to the strips of the surface active layer; and allowing the buffer strips to spread over the substrate and cover the barrier layer to form a buffer layer. The surface active layer that is sandwiched between and in direct contact with the barrier layer and the buffer layer includes a material that creates a hydrogen bond with a material of the buffer layer to enhance bonding therebetween.
1. An organic light-emitting diode (OLED) device encapsulating method configured to encapsulate an OLED, comprising:
providing a substrate that is adapted to cover an OLED and forming a barrier layer on the substrate;
forming a surface active layer on the barrier layer by inkjet printing, wherein the surface active layer comprises a plurality of strips arranged in the form of a matrix;
forming buffer strips on the surface active layer, wherein the buffer stripes are in one-to-one correspondence with the plurality of strips of the surface active layer; and
allowing the buffer strips to diffuse and overspread the substrate and cover the barrier layer to form a buffer layer;
wherein the surface active layer is sandwiched between and in direct contact with the barrier layer and the buffer layer and the surface active layer comprises a material that creates a hydrogen bond with a material of the buffer layer to enhance bonding therebetween.
2. The OLED device encapsulating method of claim 1 , wherein the surface active layer has a thickness that is less than 100 microns.
3. The OLED device encapsulating method of claim 1 , wherein the surface active layer comprises one of a hydrophilic polymer active material, a polyol based salt, and polyol based ethers.
4. The OLED device encapsulating method of claim 1 , further comprising heating the substrate to remove the surface active layer.