Display device comprising remaining portion of inspection line with cut edge
A display device includes: a substrate including a display area in which a plurality of pixels are disposed and a non-display area adjacent to the display area; a plurality of pads disposed in the non-display area; an inspection line disposed in the non-display area of the substrate and being spaced apart from the pad; a conductive member connecting the pad and the inspection line; and a tape-automated bonding integrated circuit (TAB-IC) disposed on the conductive member.
1. A display device comprising:
a substrate including a display area in which a plurality of pixels are disposed and a non-display area adjacent to the display area;
a pad disposed in the non-display area;
an inspection line disposed on the substrate to overlap a cutting line so as to form, upon being cut, a remaining portion of the inspection line with a cut edge disposed in the non-display area of the substrate and being spaced apart from the pad;
a conductive member connecting the pad to the remaining portion of the inspection line; and
a tape-automated bonding integrated circuit (TAB-IC) disposed on the conductive member, the conductive member disposed between the pad and the tape-automated bonding integrated circuit, the TAB-IC includes a flexible printed circuit board (FPCB), a drive integrated circuit (IC) mounted on the FPCB, and a lead wiring extending from the drive IC;
wherein the FPCB and the lead wiring overlap both the pad and the remaining portion of the inspection line.
2. The display device of claim 1 , further comprising a gate line and a data line disposed on the substrate, wherein the pad is connected to the gate line and the data line.
3. The display device of claim 1 , wherein the remaining portion of the inspection line is disposed in an outer portion of the non-display area than the pad.
4. The display device of claim 3 , wherein the remaining portion of the inspection line is spaced apart from the pad by a distance in a range of about 5 micrometers (μm) to 50 μm.
5. The display device of claim 1 , wherein the pad and the remaining portion of the inspection line include at least one selected from the group consisting of chrominum (Cr), aluminum (Al), molibden (Mo), titanium (Ti), tungsten (W), and gold (Au).
6. The display device of claim 1 , wherein the conductive member includes at least one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), and zinc oxide (ZnO).
7. The display device of claim 1 , wherein the drive IC includes one selected from the group consisting of a gate IC and a data IC.
8. The display device of claim 1 , wherein the lead wiring is electrically connected to the conductive member.
9. The display device of claim 1 , further comprising an anisotropic conductive film (ACF) disposed between the lead wiring and the conductive member.
10. The display device of claim 1 , wherein an area where the TAB-IC overlaps the pad is larger than an area where the TAB-IC overlaps the remaining portion of the inspection line.
11. A display device, comprising:
a first substrate;
a second substrate disposed on the first substrate having a plurality of pixels, said first substrate having a larger surface area than the second substrate, the first and second substrates have a rectangular shape;
a pad disposed on the first substrate;
an inspection line disposed on the first substrate to overlap a cutting line so as to form, upon being cut, a remaining portion of the inspection line with a cut edge;
a conductive member connecting the pad to the remaining portion of the inspection line; and
a tape-automated bonding integrated circuit (TAB-IC) disposed on the conductive member, the conductive member disposed between the pad and the tape-automated bonding integrated circuit, the TAB-IC includes a flexible printed circuit board (FPCB), a drive integrated circuit (IC) mounted on the FPCB, and a lead wiring extending from the drive IC;
wherein the pad, the remaining portion of the inspection line and the TAB-IC have no direct contact with the second substrate,
wherein the FPCB and the lead wiring overlap both the pad and the remaining portion of the inspection line.
12. The display device of claim 11 , further comprising a gate line and a data line disposed on the first substrate, wherein the pad is connected to the gate line and the data line.
13. The display device of claim 11 , wherein the remaining portion of the inspection line has a rectangular prism shape with four sides and two ends with one of the two ends directly physically connected to an inspection pad and another of the two ends having a distance from the pad in a range of about 5 micrometers (μm) to 50 μm.
14. The display device of claim 11 , wherein the pad and the remaining portion of the inspection line include at least one selected from the group consisting of chrominum (Cr), aluminum (Al), molibden (Mo), titanium (Ti), tungsten (W), and gold (Au).
15. The display device of claim 11 , wherein the conductive member includes at least one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), and zinc oxide (ZnO).
16. The display device of claim 11 , wherein the drive IC includes one selected from the group consisting of a gate IC and a data IC.
17. The display device of claim 11 , further comprising an anisotropic conductive film (ACF) disposed between the lead wiring and the conductive member.
18. The display device of claim 11 , wherein an area where the TAB-IC overlaps the pad is larger than an area where the TAB-IC overlaps the remaining portion of the inspection line.