Manufacturing method of a hollow shielding structure for circuit elements
A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.
1. A method for manufacturing a hollow shielding structure for different types of circuit elements, the method comprising:
loading a printed circuit board (PCB) on which the different types of circuit elements are mounted into a working position;
calibrating a position of a nozzle with respect to the loaded PCB;
forming a shield dam on the PCB by discharging a material from the nozzle;
placing a shield cover in an upper portion of the shield dam to cover the different types of circuit elements; and
forming an adhesion part which electrically couples the shield dam and the shield cover by applying a conductive material between the shield dam and the shield cover.
2. The method as claimed in claim 1 , wherein the calibrating of the position of the nozzle comprises:
setting a discharge start position of the nozzle by detecting a distortion degree of the PCB on an X-Y plane to a clockwise direction or counterclockwise direction with respect to a preset manufacturing position; and
setting a gap between a surface of the PCB and an end portion of the nozzle by detecting a distortion degree of the PCB on the X-Y plane to a Z-direction.
3. The method as claimed in claim 1 , wherein, after the forming of the adhesion part, the method further comprises:
removing the adhesion part from the shield dam and the shield cover;
separating the shield cover from the shield dam;
removing the shield dam from the PCB; and
removing a remaining portion of the shield dam attached to the PCB.